Method and Device for Producing a SiC Solid Material

    公开(公告)号:US20240034635A1

    公开(公告)日:2024-02-01

    申请号:US18266176

    申请日:2021-12-13

    摘要: The present invention relates to a method for producing a preferably elongated SiC solid, in particular of polytype 3C. The method according to the invention preferably includes at least the following steps: introducing at least a first source gas into a process chamber, said first source gas including Si, introducing at least one second source gas into the process chamber, the second source gas including C, electrically energizing at least one separator element disposed in the process chamber to heat the separator element, setting a deposition rate of more than 200 μm/h, where a pressure in the process chamber of more than 1 bar is generated by the introduction of the first source gas and/or the second source gas, and where the surface of the deposition element is heated to a temperature in the range between 1300° C. and 1800° C.

    SiC SUBSTRATE AND SiC INGOT
    5.
    发明公开

    公开(公告)号:US20230391627A1

    公开(公告)日:2023-12-07

    申请号:US18175934

    申请日:2023-02-28

    IPC分类号: C01B32/956

    摘要: In a SiC substrate according to the present embodiment, between any two adjacent measurement points among a plurality of first measurement points including a center and a plurality of measurement points separated from the center by 10 mm in an [11-20] direction or [−1-120] direction, a difference in absorption coefficient for light having a wavelength of 1064 nm is 0.25 cm−1 or less.