Invention Application
- Patent Title: Integrated Heat Sink and Optical Transceiver Including the Same
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Application No.: US15787492Application Date: 2017-10-18
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Publication No.: US20190113698A1Publication Date: 2019-04-18
- Inventor: Yu HUANG , Ping CUI , Chao TIAN , Jianhua CHEN , Shengzhong ZHANG , Wayne WAINWRIGHT
- Applicant: Yu HUANG , Ping CUI , Chao TIAN , Jianhua CHEN , Shengzhong ZHANG , Wayne WAINWRIGHT
- Applicant Address: US CA West Hills
- Assignee: Source Photonics, Inc.
- Current Assignee: Source Photonics, Inc.
- Current Assignee Address: US CA West Hills
- Main IPC: G02B6/42
- IPC: G02B6/42

Abstract:
Embodiments of the disclosure pertain to an optical or optoelectronic transceiver comprising an optical or optoelectronic receiver, an optical or optoelectronic transmitter, a plurality of electrical devices, a housing, and a heat sink having a non-planar surface. The optical or optoelectronic receiver includes a receiver optical subassembly (ROSA). The optical or optoelectronic transmitter includes a transmitter optical subassembly (TOSA). The electrical devices are configured to provide or control one or more functions of the optical or optoelectronic receiver and the optical or optoelectronic transmitter. The housing is over and/or enclosing the optical or optoelectronic receiver and the optical or optoelectronic transmitter. The housing includes a first section and a second section, and is configured to (a) be removably insertable into a cage or socket of a host device and (b) position the first section of the housing outside the cage or socket when the housing is inserted in the cage or socket. The heat sink is over or adjacent to the first section of the housing and is in thermal contact with the housing.
Information query