Invention Application
- Patent Title: REFLOW COMPATIBLE OPTICAL PACKAGING
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Application No.: US16225248Application Date: 2018-12-19
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Publication No.: US20190121036A1Publication Date: 2019-04-25
- Inventor: John Heck , Hari Mahalingam , Paul Yu , Kumar Satya Harinadh Potluri
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: G02B6/42
- IPC: G02B6/42

Abstract:
In various embodiments, optical fibers may be placed into V-shaped grooves in a substrate. A lid may then be placed on top of the optical fibers to hold them accurately in place, and the lid may be attached to the substrate using a reflow solder technique. Epoxy may then be applied as a strain relief. Because the V-shaped grooves and optical waveguides are manufactured with precision on the same substrate, precise alignment between these two may be achieved. Because the epoxy is applied after reflow, the epoxy may not be exposed to reflow temperatures, which might otherwise cause the epoxy to distort during the cure process.
Public/Granted literature
- US10816737B2 Reflow compatible optical packaging Public/Granted day:2020-10-27
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