公开(公告)号：US10816737B2

公开(公告)日：2020-10-27

申请号：US16225248

申请日：2018-12-19

Applicant: Intel Corporation

Inventor： John Heck ,  Hari Mahalingam ,  Paul Yu ,  Kumar Satya Harinadh Potluri

IPC: G02B6/42

Abstract: In various embodiments, optical fibers may be placed into V-shaped grooves in a substrate. A lid may then be placed on top of the optical fibers to hold them accurately in place, and the lid may be attached to the substrate using a reflow solder technique. Epoxy may then be applied as a strain relief. Because the V-shaped grooves and optical waveguides are manufactured with precision on the same substrate, precise alignment between these two may be achieved. Because the epoxy is applied after reflow, the epoxy may not be exposed to reflow temperatures, which might otherwise cause the epoxy to distort during the cure process.

公开(公告)号：US20190121036A1

公开(公告)日：2019-04-25

申请号：US16225248

申请日：2018-12-19

Applicant: Intel Corporation

Inventor： John Heck ,  Hari Mahalingam ,  Paul Yu ,  Kumar Satya Harinadh Potluri

IPC: G02B6/42

Abstract: In various embodiments, optical fibers may be placed into V-shaped grooves in a substrate. A lid may then be placed on top of the optical fibers to hold them accurately in place, and the lid may be attached to the substrate using a reflow solder technique. Epoxy may then be applied as a strain relief. Because the V-shaped grooves and optical waveguides are manufactured with precision on the same substrate, precise alignment between these two may be achieved. Because the epoxy is applied after reflow, the epoxy may not be exposed to reflow temperatures, which might otherwise cause the epoxy to distort during the cure process.