Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
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Application No.: US16202345Application Date: 2018-11-28
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Publication No.: US20190164906A1Publication Date: 2019-05-30
- Inventor: Hideaki YANAGIDA
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Priority: JP2017-229957 20171130
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/13 ; H01L23/31 ; H01L23/00 ; H01L21/48 ; H01L21/56

Abstract:
A semiconductor device includes an electroconductive shielding layer, an isolation layer formed with a frame-shaped opening, a wiring layer on the isolation layer to be surrounded by the opening, a semiconductor element on the wiring layer with its back surface facing the wiring layer, electroconductive pillars spaced apart from the semiconductor element and standing on the wiring layer, and an electroconductive frame standing on an exposed region of the shielding layer through the opening, with the frame surrounding the semiconductor element and the electroconductive pillars. The semiconductor device further includes an electrically insulating sealing resin that covers the wiring layer and the semiconductor element, and the frame is configured to be electrically connected to an external ground terminal.
Public/Granted literature
- US10658304B2 Semiconductor device and method for manufacturing the same Public/Granted day:2020-05-19
Information query
IPC分类: