公开(公告)号：US20220014147A1

公开(公告)日：2022-01-13

申请号：US17296192

申请日：2019-11-28

Applicant: ROHM CO., LTD.

Inventor： Kazuisao TSURUDA ,  Hideaki YANAGIDA

IPC: H03B7/08 ,  H01L23/28 ,  H01L23/14

Abstract: Terahertz device A1 includes first resin layer 21, columnar conductor 31, wiring layer 32, terahertz element 11, second resin layer 22, and external electrode 40. Resin layer 21 includes first resin layer obverse face 211 and first resin layer reverse face 212. Columnar conductor 31 includes first conductor obverse face 311 and first conductor reverse face 312, penetrating first resin layer 21 in z-direction. Wiring layer 32 spans between first resin layer obverse face 221 and first conductor obverse face 311. Terahertz element 11 includes element obverse face 111 and element reverse face 112, and converts between terahertz wave and electric energy. Second resin layer 22 includes second resin layer obverse face 221 and second resin layer reverse face 222, and covers wiring layer 32 and terahertz element 11. External electrode 40, disposed offset in a direction first resin layer reverse face 222 faces with respect to first resin layer 32, is electrically connected to columnar conductor 31. Terahertz element 11 is conductively bonded to wiring layer 32.

公开(公告)号：US20220352105A1

公开(公告)日：2022-11-03

申请号：US17765265

申请日：2020-09-29

Applicant: ROHM CO., LTD.

Inventor： Isamu NISHIMURA ,  Hiroyuki SHINKAI ,  Yoshihisa TAKADA ,  Hideaki YANAGIDA ,  Hirofumi TAKEDA

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L21/48 ,  H01L25/16

Abstract: A semiconductor device includes a substrate, a wire portion, a bonding portion, a semiconductor element, and an encapsulation resin. The substrate includes substrate main and back surfaces facing in opposite directions. The wire portion includes a conductive layer formed on the substrate main surface. The bonding portion includes a first plated layer formed on an upper surface of the wire portion and a first solder layer formed on an upper surface of the first plated layer. The semiconductor element includes an element main surface facing the substrate main surface, an element electrode formed on the element main surface, and a second plated layer formed on a lower surface of the element electrode and bonded to the first solder layer. The encapsulation resin covers the semiconductor element. The bonding portion is larger than the element electrode as viewed in a thickness-wise direction that is perpendicular to the substrate main surface.

公开(公告)号：US20210098374A1

公开(公告)日：2021-04-01

申请号：US17003124

申请日：2020-08-26

Applicant: ROHM CO., LTD.

Inventor： Hideaki YANAGIDA ,  Yoshihisa TAKADA

IPC: H01L23/528 ,  H01L23/00 ,  H01L23/532

Abstract: There is provided a terminal that includes a first conductive layer; a wiring layer on the first conductive layer; a second conductive layer on the wiring layer; and a conductive bonding layer which is in contact with a bottom surface and a side surface of the first conductive layer, a side surface of the wiring layer, a portion of a side surface of the second conductive layer, and a portion of a bottom surface of the second conductive layer, wherein an end portion of the second conductive layer protrudes from an end portion of the first conductive layer and an end portion of the wiring layer, and wherein the conductive bonding layer is in contact with a bottom surface of the end portion of the second conductive layer.

公开(公告)号：US20220328407A1

公开(公告)日：2022-10-13

申请号：US17851313

申请日：2022-06-28

Applicant: ROHM CO., LTD.

Inventor： Hideaki YANAGIDA ,  Yoshihisa TAKADA

IPC: H01L23/528 ,  H01L23/532 ,  H01L23/00

Abstract: There is provided a terminal that includes a first conductive layer; a wiring layer on the first conductive layer; a second conductive layer on the wiring layer; and a conductive bonding layer which is in contact with a bottom surface and a side surface of the first conductive layer, a side surface of the wiring layer, a portion of a side surface of the second conductive layer, and a portion of a bottom surface of the second conductive layer, wherein an end portion of the second conductive layer protrudes from an end portion of the first conductive layer and an end portion of the wiring layer, and wherein the conductive bonding layer is in contact with a bottom surface of the end portion of the second conductive layer.

公开(公告)号：US20220302878A1

公开(公告)日：2022-09-22

申请号：US17832209

申请日：2022-06-03

Applicant: ROHM CO., LTD.

Inventor： Kazuisao TSURUDA ,  Hideaki YANAGIDA

IPC: H03B7/08 ,  H01L23/14 ,  H01L23/28 ,  H01L23/498 ,  H01L23/538 ,  H01L23/66 ,  H01P1/20

Abstract: Terahertz device A1 includes first resin layer 21, columnar conductor 31, wiring layer 32, terahertz element 11, second resin layer 22, and external electrode 40. Resin layer 21 includes first resin layer obverse face 211 and first resin layer reverse face 212. Columnar conductor 31 includes first conductor obverse face 311 and first conductor reverse face 312, penetrating first resin layer 21 in z-direction. Wiring layer 32 spans between first resin layer obverse face 221 and first conductor obverse face 311. Terahertz element 11 includes element obverse face 111 and element reverse face 112, and converts between terahertz wave and electric energy. Second resin layer 22 includes second resin layer obverse face 221 and second resin layer reverse face 222, and covers wiring layer 32 and terahertz element 11. External electrode 40, disposed offset in a direction first resin layer reverse face 222 faces with respect to first resin layer 32, is electrically connected to columnar conductor 31. Terahertz element 11 is conductively bonded to wiring layer 32.

公开(公告)号：US20170034916A1

公开(公告)日：2017-02-02

申请号：US15180854

申请日：2016-06-13

Applicant: ROHM CO., LTD.

Inventor： Mamoru YAMAGAMI ,  Yasuhiro FUWA ,  Hideaki YANAGIDA ,  Takafumi OKADA

IPC: H05K1/18 ,  H05K3/00 ,  H05K3/46 ,  H05K1/02 ,  H05K3/30

Abstract: A multi-chip module includes a plurality of chip parts with each chip part having an electrode, a sealing resin for sealing the plurality of chip parts, and an external connection terminal secured to the sealing resin so as to be exposed from the outer surface of the sealing resin and electrically connected to the electrode of at least one of the chip parts.

Abstract translation: 多芯片模块包括多个芯片部件，每个芯片部分具有电极，用于密封多个芯片部件的密封树脂，以及固定到密封树脂的外部连接端子，以从外部表面露出 密封树脂并且电连接到至少一个芯片部分的电极。

公开(公告)号：US20160242294A1

公开(公告)日：2016-08-18

申请号：US15044878

申请日：2016-02-16

Applicant: ROHM CO., LTD.

Inventor： Hideaki YANAGIDA

IPC: H05K1/18

CPC classification number: H01L23/49872 ,  H01L21/486 ,  H01L23/13 ,  H01L23/147 ,  H01L23/3121 ,  H01L23/49827 ,  H01L2224/16235 ,  H01L2924/15156 ,  H01L2924/15313

Abstract: The present disclosure provides an electronic device suitable for miniaturization. The present electronic device includes: a substrate (1), having a main surface (111) and a back surface (112) facing opposite sides with each other in a thickness direction, wherein the substrate comprises a semiconductor material; an electronic component (8), which is disposed over the substrate (1); and a conductive layer (3), which is electrically connected with the electronic component (8); wherein a recess for disposing the component (14) and a through recess (17) are formed in the substrate, in which recess for disposing the component (14) is recessed from the main surface (111), and the through recess (17) penetrates from the recess for disposing the component (14) to the back surface (112); the electronic component (8) is disposed over the recess for disposing the component (14); a metal-filled portion (4) is formed in the through recess (17), wherein the metal-filled portion blocks at least the bottom of the through recess (17) and is filled with a metal material; and the conductive layer (3) is formed at least from the through recess (17) to the back surface (112).

Abstract translation: 本公开提供了适合于小型化的电子设备。 本电子设备包括：基板（1），其具有在厚度方向上彼此相对的主表面（111）和背面（112），其中所述基板包括半导体材料; 设置在所述基板（1）上方的电子部件（8）; 和与电子部件（8）电连接的导电层（3）。 其特征在于，在所述基板上形成有用于配置所述部件（14）和贯通凹部（17）的凹部，在所述基板中，用于配置所述部件（14）的凹部从所述主表面（111）凹进， 从所述凹部穿透以将所述部件（14）设置到所述后表面（112）; 电子部件（8）设置在用于设置部件（14）的凹部上方。 在所述贯通凹部（17）中形成金属填充部（4），所述金属填充部至少阻挡所述贯通凹部（17）的底部并填充有金属材料。 并且所述导电层（3）至少从所述贯通凹部（17）形成到所述后表面（112）。

公开(公告)号：US20190311965A1

公开(公告)日：2019-10-10

申请号：US16373253

申请日：2019-04-02

Applicant: ROHM CO., LTD.

Inventor： Hideaki YANAGIDA

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/13 ,  H01L21/48 ,  H01L21/56 ,  H01L23/538

Abstract: An electronic component includes a substrate which has a first major surface on one side and a second major surface on the other side, a chip which has a mounting surface on one side and a non-mounting surface on the other side and is disposed on the first major surface of the substrate in a posture that the mounting surface faces the first major surface of the substrate, a sealing insulation layer which seals the chip so as to expose the non-mounting surface above the first major surface of the substrate, and a cover layer which covers the non-mounting surface of the chip.

公开(公告)号：US20180108582A1

公开(公告)日：2018-04-19

申请号：US15728127

申请日：2017-10-09

Applicant: ROHM CO., LTD.

Inventor： Hideaki YANAGIDA

IPC: H01L23/10 ,  H01L23/13 ,  H01L23/14 ,  H01L23/48 ,  H01L21/02 ,  H01L21/56 ,  H01L21/48

CPC classification number: H01L23/10 ,  H01L21/02013 ,  H01L21/02697 ,  H01L21/4878 ,  H01L21/56 ,  H01L23/13 ,  H01L23/147 ,  H01L23/3121 ,  H01L23/48 ,  H01L2224/16 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A semiconductor device includes a substrate with a recess subsiding from a selected surface of the substrate to accommodate a semiconductor element. Connected to the semiconductor element, an electroconductive portion extends from the recess onto the selected surface. A post, formed at the selected surface, has a first surface in contact with the electroconductive portion, a second surface, and a side surface between the first and second surfaces. A sealing resin covers the side surface of the post and the semiconductor element, and has a mounting surface facing in the same direction as the selected surface of the substrate. A pad, on the mounting surface of the sealing resin, is in contact with the second surface of the post. In the thickness direction, the second surface of the post is offset from the mounting surface of the sealing resin toward the selected surface of the substrate.

公开(公告)号：US20170125319A1

公开(公告)日：2017-05-04

申请号：US15340915

申请日：2016-11-01

Applicant: ROHM CO., LTD.

Inventor： Hideaki YANAGIDA

IPC: H01L23/31 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L21/4853 ,  H01L23/053 ,  H01L23/13 ,  H01L23/24 ,  H01L23/49811 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/13083 ,  H01L2224/81193 ,  H01L2924/15156

Abstract: The present invention provides an electronic component in which a molding resin completely fills the space between a chip component and a mounting substrate, thereby avoiding the corrosion of the chip component and mounting substrate. The electronic component includes an interposer as an example of a mounting substrate and a chip component. The interposer is disposed with a first wiring film and a second wiring film. The chip component is interposed between a first connection electrode and a second connection electrode so as to electrically and mechanically connect the first wiring film and the second wiring film. The first connection electrode and the second connection electrode are shaped as pins mounted upright from the first wiring film and second wiring film toward the chip component such that the chip component floats above the interposer and is connected to the first wiring film and the second wiring film.