Invention Application
- Patent Title: ULTRASONIC TRANSDUCERS IN COMPLEMENTARY METAL OXIDE SEMICONDUCTOR (CMOS) WAFERS AND RELATED APPARATUS AND METHODS
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Application No.: US16197438Application Date: 2018-11-21
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Publication No.: US20190164956A1Publication Date: 2019-05-30
- Inventor: Jonathan M. Rothberg , Keith G. Fife , Nevada J. Sanchez , Susan A. Alie
- Applicant: Butterfly Network, Inc.
- Applicant Address: US CT Guilford
- Assignee: Butterfly Network, Inc.
- Current Assignee: Butterfly Network, Inc.
- Current Assignee Address: US CT Guilford
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L27/092 ; H01L23/528 ; H01L23/522 ; H01L21/768 ; B81C1/00 ; B06B1/02 ; H01L21/56 ; H01L21/3213 ; H01L21/8238 ; A61B8/00 ; B81B3/00 ; B81B7/00
Abstract:
Micromachined ultrasonic transducers formed in complementary metal oxide semiconductor (CMOS) wafers are described, as are methods of fabricating such devices. A metallization layer of a CMOS wafer may be removed by sacrificial release to create a cavity of an ultrasonic transducer. Remaining layers may form a membrane of the ultrasonic transducer.
Public/Granted literature
Information query
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