- 专利标题: DEVICE COMPRISING A MICRO-ELECTRO-MECHANICAL SYSTEM SUBSTRATE WITH PROTRUSIONS OF DIFFERENT HEIGHTS THAT HAS BEEN INTEGRATED WITH A COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR SUBSTRATE
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申请号: US16206861申请日: 2018-11-30
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公开(公告)号: US20190185317A1公开(公告)日: 2019-06-20
- 发明人: Jongwoo Shin , Houri Johari-Galle , Bongsang Kim , Joseph Seeger , Dongyang Kang
- 申请人: INVENSENSE, INC.
- 主分类号: B81B7/00
- IPC分类号: B81B7/00 ; B81C1/00
摘要:
A device comprising a micro-electro-mechanical system (MEMS) substrate with protrusions of different heights that has been integrated with a complementary metal-oxide-semiconductor (CMOS) substrate is presented herein. The MEMS substrate comprises defined protrusions of respective distinct heights from a surface of the MEMS substrate, and the MEMS substrate is bonded to the CMOS substrate. In an aspect, the defined protrusions can be formed from the MEMS substrate. In another aspect, the defined protrusions can be deposited on, or attached to, the MEMS substrate. In yet another aspect, the MEMS substrate comprises monocrystalline silicon and/or polysilicon. In yet even another aspect, the defined protrusions comprise respective electrodes of sensors of the device.