Invention Application
- Patent Title: DEVICE COMPRISING INTEGRATION OF DIE TO DIE WITH POLYMER PLANARIZATION LAYER
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Application No.: US16135906Application Date: 2018-09-19
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Publication No.: US20190259677A1Publication Date: 2019-08-22
- Inventor: Jon LASITER , Ravindra Vaman SHENOY , Kambiz SAMADI , Jing XIE
- Applicant: QUALCOMM Incorporated
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L21/768 ; H01L23/48 ; H01L23/538 ; H01L21/56 ; H01L21/02
Abstract:
A device comprising a first die, a second die coupled to a first die, and a polymer planarization layer. The second die includes a side portion and a backside portion. The polymer planarization layer is coupled to the first die and the second die such that the polymer planarization layer is coupled to the side portion and the backside portion of the second die. The polymer planarization layer includes an organic polymer. The polymer planarization layer may include a self planarizing material.
Information query
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