Invention Application
- Patent Title: TEMPERATURE-ACTUATED VALVE, FLUIDIC DEVICE, AND RELATED METHODS OF USE
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Application No.: US16354987Application Date: 2019-03-15
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Publication No.: US20190285187A1Publication Date: 2019-09-19
- Inventor: Paul Yager , Joshua Bishop , Michael Purfield
- Applicant: University of Washington
- Applicant Address: US WA Seattle
- Assignee: University of Washington
- Current Assignee: University of Washington
- Current Assignee Address: US WA Seattle
- Main IPC: F16K17/38
- IPC: F16K17/38 ; F16K99/00

Abstract:
Temperature-actuated valves, devices including temperature-actuated valves, and related methods are described. In an embodiment, the temperature-actuated valve includes a heat-shrink film defining a perforation extending at least partially in a first direction. In an embodiment, the temperature-actuated valve is configured to open when a portion of the heat-shrink film including the perforation is heated above a threshold temperature to contract the heat-shrink film along a second direction perpendicular to the first direction to define an aperture, in an open configuration, providing a fluid a path through the heat-shrink film. In an embodiment, the temperature-actuated valve includes a leakage-mitigation feature configured to limit fluid flow through the perforation when the valve is in a closed configuration.
Public/Granted literature
- US10935149B2 Temperature-actuated valve, fluidic device, and related methods of use Public/Granted day:2021-03-02
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