Invention Application
- Patent Title: DUAL SIDE DE-BONDING IN COMPONENT CARRIERS USING PHOTOABLATION
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Application No.: US15922749Application Date: 2018-03-15
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Publication No.: US20190287841A1Publication Date: 2019-09-19
- Inventor: Frank Truong , Praneeth Akkinepally , Chelsea M. Groves , Whitney M. Bryks , Jason M. Gamba , Brandon C. Marin
- Applicant: Intel Corporation
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/687 ; C09J5/06
Abstract:
A system is disclosed, which comprises a component carrier having a first side, and a second side opposite the first side; and a light source to couple light into the carrier. In an example, the carrier is to propagate, through internal reflection, at least a portion the light to both the first and second sides of the carrier. The portion of light may be sufficient to release a first component and second component affixed to the first and second sides of the carrier via a first photosensitive layer and second photosensitive layer, respectively.
Public/Granted literature
- US11462432B2 Dual side de-bonding in component carriers using photoablation Public/Granted day:2022-10-04
Information query
IPC分类:
