Invention Application
- Patent Title: INTEGRATED CIRCUIT DEVICES AND METHOD OF MANUFACTURING THE SAME
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Application No.: US16275942Application Date: 2019-02-14
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Publication No.: US20190363009A1Publication Date: 2019-11-28
- Inventor: Jin-yeong JOE , Seok-hoon KIM , Jeong-ho YOO , Seung-hun LEE , Geun-hee JEONG
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2018-0058640 20180523
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/528

Abstract:
An integrated circuit device includes a fin-type active region extending on a substrate in a first direction parallel to a top surface of the substrate; a gate structure extending on the fin-type active region and extending in a second direction parallel to the top surface of the substrate and different from the first direction; and source/drain regions in a recess region extending from one side of the gate structure into the fin-type active region, the source/drain regions including an upper semiconductor layer on an inner wall of the recess region, having a first impurity concentration, and including a gap; and a gap-fill semiconductor layer, which fills the gap and has a second impurity concentration that is greater than the first impurity concentration.
Public/Granted literature
- US10714387B2 Integrated circuit devices and method of manufacturing the same Public/Granted day:2020-07-14
Information query
IPC分类: