Invention Application
- Patent Title: ANTENNA MODULES AND COMMUNICATION DEVICES
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Application No.: US16000795Application Date: 2018-06-05
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Publication No.: US20190372229A1Publication Date: 2019-12-05
- Inventor: Sidharth Dalmia , Trang Thai , William James Lambert , Zhichao Zhang , Jiwei Sun
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01Q9/04
- IPC: H01Q9/04 ; H01Q1/08 ; H01Q1/22

Abstract:
Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.
Public/Granted literature
- US10797394B2 Antenna modules and communication devices Public/Granted day:2020-10-06
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