- 专利标题: CHEMICAL CONTROL FEATURES IN WAFER PROCESS EQUIPMENT
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申请号: US16511990申请日: 2019-07-15
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公开(公告)号: US20190385823A1公开(公告)日: 2019-12-19
- 发明人: Qiwei Liang , Xinglong Chen , Kien Chuc , Dmitry Lubomirsky , Soonam Park , Jang-Gyoo Yang , Shankar Venkataraman , Toan Tran , Kimberly Hinckley , Saurabh Garg
- 申请人: Applied Materials, Inc.
- 申请人地址: US CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: US CA Santa Clara
- 主分类号: H01J37/32
- IPC分类号: H01J37/32 ; H01L21/67 ; C23C16/50 ; B05B1/18 ; C23C16/455 ; C23C16/452 ; B05B1/00
摘要:
Gas distribution assemblies are described including an annular body, an upper plate, and a lower plate. The upper plate may define a first plurality of apertures, and the lower plate may define a second and third plurality of apertures. The upper and lower plates may be coupled with one another and the annular body such that the first and second apertures produce channels through the gas distribution assemblies, and a volume is defined between the upper and lower plates.
公开/授权文献
- US11264213B2 Chemical control features in wafer process equipment 公开/授权日:2022-03-01
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