- 专利标题： SURFACE FINISHES FOR HIGH DENSITY INTERCONNECT ARCHITECTURES
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申请号： US16561974申请日： 2019-09-05
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公开(公告)号： US20190393178A1公开(公告)日： 2019-12-26
- 发明人: David Unruh , Srinivas V. Pietambaram
- 申请人： Intel Corporation
- 主分类号： H01L23/00
- IPC分类号： H01L23/00
摘要：
An electroless nickel, electroless palladium, electroless tin stack and. associated methods are shown. An example method to form a solder bump may include forming a layer of a second material over a first material at a base of a trench in a solder resist layer. The first material includes nickel and the second material includes palladium. The method further includes depositing a third material that includes tin on the second material using an electroless deposition process, and forming a solder bump out of the third material using a reflow and deflux process.
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