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Invention Application
US20200006777A1 COPPER FOIL HAVING EXCELLENT ADHESIVE STRENGTH, ELECTRODE COMPRISING SAME, SECONDARY BATTERY COMPRISING SAME, AND MANUFACTURING METHOD THEREFOR 审中-公开

  • Patent Title: COPPER FOIL HAVING EXCELLENT ADHESIVE STRENGTH, ELECTRODE COMPRISING SAME, SECONDARY BATTERY COMPRISING SAME, AND MANUFACTURING METHOD THEREFOR
  • Application No.: US16489021
    Application Date: 2018-02-26
  • Publication No.: US20200006777A1
    Publication Date: 2020-01-02
  • Inventor: Seung Min KIM
  • Applicant: KCF Technologies Co., Ltd.
  • Priority: KR10-2017-0025581 20170227
  • International Application: PCT/KR2018/002311 WO 20180226
  • Main IPC: H01M4/66
  • IPC: H01M4/66 ;  H05K1/09 ;  H05K3/02 ;  C25D1/04
COPPER FOIL HAVING EXCELLENT ADHESIVE STRENGTH, ELECTRODE COMPRISING SAME, SECONDARY BATTERY COMPRISING SAME, AND MANUFACTURING METHOD THEREFOR
Abstract:
An embodiment of the present invention provides a copper foil which comprises a copper layer and an anticorrosive film placed on the copper layer, and has a Young's modulus of 3800 to 4600 kgf/mm2 and a modulus bias factor (MBF) less than 0.12, wherein the modulus bias factor (MBF) is obtained by formula 1 below. MBF=(maximum Young's modulus-minimum Young's modulus)/(average Young's modulus)  [Formula 1]
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