ELECTROLYTIC COPPER FOIL HAVING EXCELLENT HANDLING CHARACTERISTICS IN POSTPROCESSING, AND MANUFACTURING METHOD THEREFOR

    公开(公告)号:US20210025066A1

    公开(公告)日:2021-01-28

    申请号:US16959352

    申请日:2019-01-25

    Abstract: The present invention relates to an electrolytic copper foil having excellent handling characteristics in the manufacture of copper foil and in post-processing for manufacturing a secondary battery. The present invention provides an electrolytic copper foil having a first surface and a second surface, wherein the texture coefficient of the (220) plane of the electrolytic copper foil is 0.4-1.32, the difference (|Δ(Rz/Ra)|) between Rz/Ra on the first surface and Rz/Ra on the second surface, of the electrolytic copper foil, is less than 2.42, and the difference (|ΔPD|) in peak density (PD) between the first surface and the second surface, of the electrolytic copper foil, is 96 ea or less.

    ELECTROLYTIC COPPER FOIL, METHOD FOR PRODUCING SAME, AND HIGH-CAPACITY LI SECONDARY BATTERY NEGATIVE ELECTRODE INCLUDING SAME

    公开(公告)号:US20200277705A1

    公开(公告)日:2020-09-03

    申请号:US16643758

    申请日:2018-08-24

    Abstract: The present invention relates to an electrolytic copper foil current collector where the surface properties are controlled to achieve a high adhesiveness to a negative electrode material. An electrolytic copper foil has a first surface and the second surface, the electrolytic copper foil comprising a first protective layer on the first surface side, a second protective layer on the second surface side, and a copper film between the first and second protective layers, wherein the coupling coefficient at the first surface or second surface of the electrolytic copper foil is 1.5 to 9.4 as represented by coupling coefficient=Rp/μm+peak density/30+amount of Cr adhesion/(mg/m2) (here, peak density is measured according to ASME standard B46.1). The electrolytic copper foil has a high adhesiveness to a negative electrode material and a low electrical resistance can be provided by controlling the surface properties of the electrolytic copper foil surface.

Patent Agency Ranking