Invention Application
- Patent Title: Cavity based feature on chip carrier
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Application No.: US16578710Application Date: 2019-09-23
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Publication No.: US20200020649A1Publication Date: 2020-01-16
- Inventor: Edward Myers , Thomas Bemmerl , Melissa Stahl
- Applicant: Infineon Technologies AG
- Priority: DE102016108060.8 20160429
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/495 ; H01L23/31 ; H01L21/56 ; H01L21/48
Abstract:
A package comprising an electronic chip with at least one electric contact structure, an electrically conductive chip carrier having at least one coupling cavity, and a coupling structure located at least partially in the at least one coupling cavity and electrically contacting the at least one electric contact structure with the chip carrier.
Information query
IPC分类:
