公开(公告)号：US09082737B2

公开(公告)日：2015-07-14

申请号：US13678421

申请日：2012-11-15

Applicant: Infineon Technologies AG

Inventor： Carlo Baterna Marbella ,  Ganesh Vetrivel Periasamy ,  Woon Yik Yong ,  Kok Kiat Koo ,  Christian Arndt ,  Edward Myers

IPC: H01L23/34 ,  H01L23/495 ,  H01L25/16 ,  H01L23/31

CPC classification number: H01L23/34 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/49555 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor package including a fail open mechanism is disclosed. An embodiment includes a semiconductor package having a chip carrier, a chip disposed on the chip carrier and an encapsulant encapsulating the chip and the chip carrier. The semiconductor package further including a pin protruding from the encapsulant and a fail open mechanism disposed on the encapsulant and connected to the pin, wherein the fail open mechanism is configured to be disconnected from the pin if a temperature exceeds a pre-determined temperature.

Abstract translation: 公开了一种包括故障打开机构的半导体封装。 一个实施例包括具有芯片载体的半导体封装，设置在芯片载体上的芯片和封装芯片和芯片载体的密封剂。 所述半导体封装还包括从所述密封剂突出的销和设置在所述密封剂上并连接到所述销的故障开放机构，其中所述故障开启机构被配置为如果温度超过预定温度则与所述销断开。

公开(公告)号：US20140131844A1

公开(公告)日：2014-05-15

申请号：US13678421

申请日：2012-11-15

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Carlo Baterna Marbella ,  Ganesh Vetrivel Periasamy ,  Woon Yik Yong ,  Kok Kiat Koo ,  Christian Arndt ,  Edward Myers

IPC: H01L23/34 ,  H01L23/495

CPC classification number: H01L23/34 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/49555 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor package including a fail open mechanism is disclosed. An embodiment includes a semiconductor package having a chip carrier, a chip disposed on the chip carrier and an encapsulant encapsulating the chip and the chip carrier. The semiconductor package further including a pin protruding from the encapsulant and a fail open mechanism disposed on the encapsulant and connected to the pin, wherein the fail open mechanism is configured to be disconnected from the pin if a temperature exceeds a pre-determined temperature.

Abstract translation: 公开了一种包括故障打开机构的半导体封装。 一个实施例包括具有芯片载体的半导体封装，设置在芯片载体上的芯片和封装芯片和芯片载体的密封剂。 所述半导体封装还包括从所述密封剂突出的销和设置在所述密封剂上并连接到所述销的故障开放机构，其中所述故障开启机构被配置为如果温度超过预定温度则与所述销断开。

公开(公告)号：US11088105B2

公开(公告)日：2021-08-10

申请号：US16695866

申请日：2019-11-26

Applicant: Infineon Technologies AG

Inventor： Thomas Bemmerl ,  Chooi Mei Chong ,  Edward Myers ,  Michael Stadler

IPC: H01L23/00

Abstract: A semiconductor device includes: a carrier having a die pad and a contact; a semiconductor die having opposing first and second main sides and being attached to the die pad by a first solder joint such that the second main side faces the die pad; and a contact clip having a first contact region and a second contact region. The first contact is attached to the first main side by a second solder joint. The second contact region is attached to the contact by a third solder joint. The first contact region has a convex shape facing towards the first main side such that a distance between the first main side and the first contact region increases from a base of the convex shape towards an edge of the first contact region. The base runs along a line that is substantially perpendicular to a longitudinal axis of the contact clip.

公开(公告)号：US20200020649A1

公开(公告)日：2020-01-16

申请号：US16578710

申请日：2019-09-23

Applicant: Infineon Technologies AG

Inventor： Edward Myers ,  Thomas Bemmerl ,  Melissa Stahl

IPC: H01L23/00 ,  H01L23/495 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48

Abstract: A package comprising an electronic chip with at least one electric contact structure, an electrically conductive chip carrier having at least one coupling cavity, and a coupling structure located at least partially in the at least one coupling cavity and electrically contacting the at least one electric contact structure with the chip carrier.

公开(公告)号：US11239127B2

公开(公告)日：2022-02-01

申请号：US16906617

申请日：2020-06-19

Applicant: Infineon Technologies AG

Inventor： Edward Myers ,  Liu Chen ,  Chee Chiew Chong ,  Wee Aun Jason Lim ,  Wee Boon Tay

IPC: H01L23/48 ,  H01L23/31 ,  H01L23/36 ,  H01L23/00 ,  H01L21/56 ,  H01L23/498

Abstract: A molded semiconductor package arrangement may comprise a die pad configured to support a semiconductor; a set of leads; and a mold structure that is formed to enclose the semiconductor and the die pad within the mold structure. The set of leads and the die pad may be formed from a same piece of conductive material. An electrical contact plane of the set of leads may be offset from a bottom surface of the die pad. The mold structure may include a molded standoff that is beneath the die pad. A bottom surface of the molded standoff may extend below the electrical contact plane of the set of leads by a threshold distance that corresponds to a thickness of the molded standoff.

公开(公告)号：US11869865B2

公开(公告)日：2024-01-09

申请号：US17389721

申请日：2021-07-30

Applicant: Infineon Technologies AG

Inventor： Thomas Bemmerl ,  Chooi Mei Chong ,  Edward Myers ,  Michael Stadler

IPC: H01L23/00

CPC classification number: H01L24/37 ,  H01L24/84 ,  H01L2224/37012 ,  H01L2224/84345 ,  H01L2224/84815 ,  H01L2924/3656

Abstract: A semiconductor device includes: a carrier having a die pad and a contact; a semiconductor die having opposing first and second main sides and being attached to the die pad by a first solder joint such that the second main side faces the die pad; and a contact clip having a first contact region and a second contact region. The first contact is attached to the first main side by a second solder joint. The second contact region is attached to the contact by a third solder joint. The first contact region has a convex shape facing towards the first main side such that a distance between the first main side and the first contact region increases from a base of the convex shape towards an edge of the first contact region. The base runs along a line that is substantially perpendicular to a longitudinal axis of the contact clip.

公开(公告)号：US20230095545A1

公开(公告)日：2023-03-30

申请号：US17950662

申请日：2022-09-22

Applicant: Infineon Technologies AG

Inventor： Paul Armand Calo ,  Thomas Bemmerl ,  Joo Ming Goa ,  Edward Myers ,  Wee Boon Tay ,  Stefan Macheiner ,  Markus Dinkel ,  Andreas Piller

IPC: H01L23/495 ,  H01L23/498 ,  H01L21/48 ,  H01L23/31

Abstract: A semiconductor package includes a leadframe including a diepad and a first row of leads, wherein at least one lead of the first row of leads is physically separated from the diepad by a gap. The semiconductor package further includes a semiconductor component arranged on the leadframe. The semiconductor package further includes an encapsulation material encapsulating the leadframe and the semiconductor component, wherein the encapsulation material includes a bottom surface arranged at a bottom surface of the semiconductor package, a top surface and a side surface extending from the bottom surface to the top surface. A side surface of at least one lead of the first row of leads is flush with the side surface of the encapsulation material. The flush side surface of the at least one lead is covered by an electroplated metal coating.

公开(公告)号：US20210358877A1

公开(公告)日：2021-11-18

申请号：US17389721

申请日：2021-07-30

Applicant: Infineon Technologies AG

Inventor： Thomas Bemmerl ,  Chooi Mei Chong ,  Edward Myers ,  Michael Stadler

IPC: H01L23/00

Abstract: A semiconductor device includes: a carrier having a die pad and a contact; a semiconductor die having opposing first and second main sides and being attached to the die pad by a first solder joint such that the second main side faces the die pad; and a contact clip having a first contact region and a second contact region. The first contact is attached to the first main side by a second solder joint. The second contact region is attached to the contact by a third solder joint. The first contact region has a convex shape facing towards the first main side such that a distance between the first main side and the first contact region increases from a base of the convex shape towards an edge of the first contact region. The base runs along a line that is substantially perpendicular to a longitudinal axis of the contact clip.

公开(公告)号：US20200168575A1

公开(公告)日：2020-05-28

申请号：US16695866

申请日：2019-11-26

Applicant: Infineon Technologies AG

Inventor： Thomas Bemmerl ,  Chooi Mei Chong ,  Edward Myers ,  Michael Stadler

IPC: H01L23/00

Abstract: A semiconductor device includes: a carrier having a die pad and a contact; a semiconductor die having opposing first and second main sides and being attached to the die pad by a first solder joint such that the second main side faces the die pad; and a contact clip having a first contact region and a second contact region. The first contact is attached to the first main side by a second solder joint. The second contact region is attached to the contact by a third solder joint. The first contact region has a convex shape facing towards the first main side such that a distance between the first main side and the first contact region increases from a base of the convex shape towards an edge of the first contact region. The base runs along a line that is substantially perpendicular to a longitudinal axis of the contact clip.

公开(公告)号：US20180218992A1

公开(公告)日：2018-08-02

申请号：US15886634

申请日：2018-02-01

Applicant: Infineon Technologies AG

Inventor： Valerie Vivares ,  Edward Myers

IPC: H01L23/00 ,  H01L23/31 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/304

CPC classification number: H01L24/13 ,  H01L21/304 ,  H01L21/31053 ,  H01L21/32115 ,  H01L23/3157 ,  H01L24/03 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L24/84 ,  H01L2224/03002 ,  H01L2224/0346 ,  H01L2224/0362 ,  H01L2224/04026 ,  H01L2224/04034 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/05693 ,  H01L2224/06181 ,  H01L2224/1146 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13193 ,  H01L2224/13564 ,  H01L2224/1357 ,  H01L2224/16104 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/40227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/84801 ,  H01L2224/94 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/03

Abstract: A semiconductor device includes a semiconductor die having a first main face, a second main face and side faces connecting the first main face and the second main face. The semiconductor device also includes a conductive column arranged on the first main face of the semiconductor die and electrically coupled to the semiconductor die, and an insulating body arranged on the first main face of the semiconductor die. The insulating body has an upper main face and side faces. The upper main surface of the insulating body is coplanar with a top face of the conductive pillar. The semiconductor device further includes a metal layer arranged on the top face of the conductive pillar. The side faces of the semiconductor die and the side faces of the insulating body are coplanar.