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公开(公告)号：US11862582B2
公开(公告)日：2024-01-02
申请号：US17502084
申请日：2021-10-15
IPC分类号： H01L23/495 , H01L23/00 , H01L23/31 , H01L21/56 , H01L21/48
CPC分类号： H01L23/564 , H01L21/481 , H01L21/4828 , H01L21/56 , H01L23/3121 , H01L23/49541 , H01L24/73 , H01L24/92 , H01L2224/73265 , H01L2224/92247
摘要： A package is disclosed. In one example, the package comprises a carrier, an electronic component mounted on the carrier, an encapsulant encapsulating at least part of the electronic component and at least part of the carrier and having a bottom side at a first vertical level. At least one lead is electrically coupled with the electronic component and comprising a first lead portion being encapsulated in the encapsulant and a second lead portion extending out of the encapsulant at the bottom side of the encapsulant. A functional structure at the bottom side extends up to a second vertical level different from the first vertical level.
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公开(公告)号：US20200373228A1
公开(公告)日：2020-11-26
申请号：US16422163
申请日：2019-05-24
发明人： Ke Yan Tean , Thomas Bemmerl , Thai Kee Gan , Azlina Kassim
IPC分类号： H01L23/495 , H01L23/31 , H01L21/48
摘要： A semiconductor package includes a die pad having a die attach surface, a rear surface opposite the die attach surface, and an outer edge side extending between the die attach surface and the rear surface, the outer edge side having a step-shaped profile, wherein an upper section of the die pad laterally overhangs past a lower section of the die pad, a semiconductor die mounted on the die attach surface and having a first electrical terminal on an upper surface of the semiconductor die, and a first conductive clip that directly electrically contacts the first electrical terminal and wraps around the outer edge side of the die pad such that a section of the first conductive clip is at least partially within an area that is directly below the upper section of the die pad and directly laterally adjacent to the lower section.
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3.发明申请公开(公告)号：US20190189542A1
公开(公告)日：2019-06-20
申请号：US16219415
申请日：2018-12-13
发明人： Thomas Bemmerl , Kuok Wai Chan , Christoph Liebl , Bun Kian Tay , Wee Boon Tay , Wae Chet Yong
IPC分类号： H01L23/495 , H01L23/31 , H01L21/48 , H01L21/56 , H01L23/00
CPC分类号： H01L23/49503 , H01L21/4828 , H01L21/56 , H01L23/3157 , H01L23/49548 , H01L24/49
摘要： A leadless package includes an at least partially electrically conductive carrier having a mounting section and a lead section, an electronic chip mounted on the mounting section, and an encapsulant at least partially encapsulating the electronic chip and partially encapsulating the carrier so that at least part of an interior sidewall of the lead section not forming part of an exterior sidewall of the package is exposed.
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公开(公告)号：US20180338379A1
公开(公告)日：2018-11-22
申请号：US15982778
申请日：2018-05-17
发明人： Thomas Bemmerl , Joachim Mahler
摘要： An electronic device includes a component, an electronic component, and a joining material arranged between a surface of the component and a surface of the electronic component. Spacer elements are embedded in the joining material. Interconnects are arranged between the spacer elements and the surface of the component, and between the spacer elements and the surface of the electronic component.
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公开(公告)号：US20190333874A1
公开(公告)日：2019-10-31
申请号：US16382866
申请日：2019-04-12
发明人： Thomas Bemmerl , Martin Gruber , Thorsten Scharf
IPC分类号： H01L23/00 , H01L23/495 , H01L21/48
摘要： A semiconductor device is disclosed. In one example, the semiconductor device comprises a first semiconductor die comprising a first surface, a second surface opposite to the first surface, and a contact pad disposed on the first surface, a further contact pad spaced apart from the semiconductor die, a clip comprising a first layer of a first metallic material and a second layer of a second metallic material different from the first metallic material, wherein the first layer of the clip is connected with the contact pad, and the second layer of the clip is connected with the further contact pad.
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公开(公告)号：US11869830B2
公开(公告)日：2024-01-09
申请号：US16678000
申请日：2019-11-08
发明人： Michael Stadler , Thomas Bemmerl
IPC分类号： H01L23/31 , H01L23/495 , H01L23/00 , H01L21/48
CPC分类号： H01L23/49517 , H01L21/4828 , H01L23/3121 , H01L23/49541 , H01L23/49582 , H01L24/83 , H01L2224/83815
摘要： A clip, a semiconductor package, and a method are disclosed. In one example the clip includes a die attach portion having a first main face and a second main face opposite to the first main face, and at least one through-hole extending between the first and second main faces and including a curved transition from an inner wall of the at least one through-hole to the first main face.
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公开(公告)号：US10950509B2
公开(公告)日：2021-03-16
申请号：US16399603
申请日：2019-04-30
发明人： Rainald Sander , Thomas Bemmerl , Steffen Thiele
IPC分类号： H01L27/092 , H01L29/06 , H01L21/66 , H01L23/495 , H01L21/48
摘要： A semiconductor device includes a first chip pad, a power semiconductor chip arranged on the first chip pad and including at least a first and a second power electrode, and a clip connected to the first power electrode. In this case, an integral part of the clip forms a shunt resistor and a first contact finger of the shunt resistor is embodied integrally with the clip.
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公开(公告)号：US20190304858A1
公开(公告)日：2019-10-03
申请号：US16365837
申请日：2019-03-27
发明人： Thorsten Scharf , Ralf Otremba , Thomas Bemmerl , Irmgard Escher-Poeppel , Martin Gruber , Michael Juerss , Thorsten Meyer , Xaver Schloegel
IPC分类号： H01L23/053 , H01L23/40 , H01L23/00 , H01L23/08
摘要： A semiconductor package system comprises a semiconductor package and a cap. The semiconductor package comprises a die pad, a chip mounted or arranged to a first main face of the die pad and an encapsulation body encapsulating the chip and the die pad. The cap covers at least partly an exposed second main face of the die pad. The cap comprises a cap body of an electrically insulating and thermally conductive material and a fastening system fastening the cap to the semiconductor package. The fastening system extends from the cap body towards the encapsulation body or along a side surface of the semiconductor package.
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公开(公告)号：US09484278B2
公开(公告)日：2016-11-01
申请号：US14091545
申请日：2013-11-27
发明人： Thomas Bemmerl
IPC分类号： H01L23/495 , H01L23/31
CPC分类号： H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00012
摘要： A semiconductor package includes a housing having a bottom surface and an upper surface and a solder pad arranged in the bottom surface of the housing. The solder pad includes a solderable through hole. The housing includes an opening extending from the through hole to the upper surface of the housing.
摘要翻译： 半导体封装包括具有底表面和上表面的壳体和布置在壳体的底表面中的焊盘。 焊盘包括可焊接通孔。 壳体包括从通孔延伸到壳体的上表面的开口。
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公开(公告)号：US11088105B2
公开(公告)日：2021-08-10
申请号：US16695866
申请日：2019-11-26
发明人： Thomas Bemmerl , Chooi Mei Chong , Edward Myers , Michael Stadler
IPC分类号： H01L23/00
摘要： A semiconductor device includes: a carrier having a die pad and a contact; a semiconductor die having opposing first and second main sides and being attached to the die pad by a first solder joint such that the second main side faces the die pad; and a contact clip having a first contact region and a second contact region. The first contact is attached to the first main side by a second solder joint. The second contact region is attached to the contact by a third solder joint. The first contact region has a convex shape facing towards the first main side such that a distance between the first main side and the first contact region increases from a base of the convex shape towards an edge of the first contact region. The base runs along a line that is substantially perpendicular to a longitudinal axis of the contact clip.
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