Invention Application
- Patent Title: STACKED METAL-OXIDE-SEMICONDUCTOR, METAL-OXIDE-METAL, AND METAL-INSULATOR-METAL CAPACITORS
-
Application No.: US16035387Application Date: 2018-07-13
-
Publication No.: US20200020686A1Publication Date: 2020-01-16
- Inventor: Junjing BAO , Yan WANG , Jie DENG , Giridhar NALLAPATI
- Applicant: QUALCOMM Incorporated
- Main IPC: H01L27/08
- IPC: H01L27/08 ; H01L29/94 ; H01L29/66 ; H01L49/02 ; H01L23/522

Abstract:
An integrated circuit (e.g., a stacked capacitor) achieves higher capacitor density without additional area consumption. The integrated circuit includes a metal-oxide-semiconductor capacitor (MOSCAP), a metal-oxide-metal capacitor (MOMCAP) and a metal-insulator-metal capacitor (MIMCAP) stacked together. The MOSCAP includes a gate and source/drain (S/D) regions. The MOMCAP is included in back-end-of-line (BEOL) layers over the MOSCAP or supported by the MOSCAP.
Information query
IPC分类: