Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
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Application No.: US16485496Application Date: 2017-02-14
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Publication No.: US20200020775A1Publication Date: 2020-01-16
- Inventor: Wei NI , Tetsuya HAYASHI , Ryota TANAKA , Keisuke TAKEMOTO , Yasuaki HAYAMI
- Applicant: NISSAN MOTOR CO., LTD.
- Applicant Address: JP Yokohama-shi, Kanagawa
- Assignee: NISSAN MOTOR CO., LTD.
- Current Assignee: NISSAN MOTOR CO., LTD.
- Current Assignee Address: JP Yokohama-shi, Kanagawa
- International Application: PCT/JP2017/005333 WO 20170214
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L29/78 ; H01L29/66

Abstract:
There are included a first conductivity-type first drift region formed on a first main surface of a substrate, and a first conductivity-type second drift region formed on the first main surface of the substrate, the second drift region formed to be reached to a deeper position of the substrate than a position of the first drift region. There are further included a second conductivity-type well region in contact with the second drift region, a first conductivity-type source region formed to extend in a direction perpendicular to a surface of the well region, and a first conductivity-type drain region separated from the well region, the drain region formed to extend in a direction perpendicular to a surface of the first drift region. Since a flow path of electrons after passing through a channel can be widened, a resistance can be reduced.
Information query
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