Invention Application
- Patent Title: MULTI-LAYER STRUCTURE AND METHOD OF MAKING SAME
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Application No.: US16500997Application Date: 2018-04-04
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Publication No.: US20200031710A1Publication Date: 2020-01-30
- Inventor: Satish Chandra Chaparala , Kristen Lorraine Eckart , Kurt Edward Gerber , Ming-Huang Huang , Nagaraja Shashidhar , Huan-Hung Sheng , Michael Lesley Sorensen , Ananthanarayanan Subramanian
- Applicant: CORNING INCORPORATED
- International Application: PCT/US2018/025975 WO 20180404
- Main IPC: C03C21/00
- IPC: C03C21/00 ; C03C15/00 ; C03C27/10 ; B32B17/10 ; B32B7/12 ; B32B37/12 ; B32B37/18 ; H05K1/02

Abstract:
A multi-layer and method of making the same are provided. The multi-layer, such as a sensor, can include a high strength glass overlay and a lamination layer on a substrate layer. The overlay can be less than 250 micrometers thick and have at least one tempered surface incorporating a surface compression layer of at least 5 micrometers deep and a surface compressive stress of at least 200 MPa. The overlay can exhibit a puncture factor of at least 3000 N/μm2 at B10 (10thpercentile of the probability distribution of failure) in a multi-layer structure, an apparent thickness of less than 0.014 mm, and a pencil hardness greater than 6H. The method can include ion-exchange tempering at least one major surface of a glass sheet, light etching the major surface to remove flaws and laminating the glass sheet on the tempered and lightly etched major surface to a substrate layer.
Public/Granted literature
- US11591257B2 Multi-layer structure and method of making same Public/Granted day:2023-02-28
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