Invention Application
- Patent Title: APPARATUS FOR MEASURING SAMPLE THICKNESS AND METHOD FOR MEASURING SAMPLE THICKNESS
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Application No.: US16412706Application Date: 2019-05-15
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Publication No.: US20200049496A1Publication Date: 2020-02-13
- Inventor: Seonghyeon CHEON
- Applicant: Samsung Display Co., Ltd.
- Priority: KR10-2018-0094214 20180813
- Main IPC: G01B15/02
- IPC: G01B15/02 ; F25D19/00
Abstract:
An apparatus for measuring thickness includes: a chamber; a sound wave transmitter transmitting a sound wave in the chamber; a sound wave receiver receiving the sound wave transmitted from the sound wave transmitter in the chamber; and a supporter between the sound wave transmitter and the sound wave receiver.
Public/Granted literature
- US11788835B2 Apparatus for measuring sample thickness and method for measuring sample thickness Public/Granted day:2023-10-17
Information query
