APPARATUS AND METHOD FOR MONITORING CHEMICAL MECHANICAL POLISHING

    公开(公告)号:US20200180103A1

    公开(公告)日:2020-06-11

    申请号:US16582658

    申请日:2019-09-25

    摘要: An apparatus for monitoring polishing includes a substrate transferring unit configured to transfer a substrate including at least one inorganic layer along a first direction; a polishing unit on the substrate transferring unit; a cleaning unit and a drying unit on the substrate transferring unit; and a monitoring unit on the substrate transferring unit, the monitoring unit including a plurality of optical probes configured to measure reflected lights reflected from respective ones of a plurality of different positions of the substrate. The polishing unit, the cleaning unit, the drying unit, and the monitoring unit are sequentially located along the first direction.