-
公开(公告)号:US20200180103A1
公开(公告)日:2020-06-11
申请号:US16582658
申请日:2019-09-25
发明人: Sangheon YE , Seyoon OH , Seonghyeon CHEON
IPC分类号: B24B49/12 , B24B37/005 , B24B37/27 , B24B37/34 , B24B53/017 , G01B11/06
摘要: An apparatus for monitoring polishing includes a substrate transferring unit configured to transfer a substrate including at least one inorganic layer along a first direction; a polishing unit on the substrate transferring unit; a cleaning unit and a drying unit on the substrate transferring unit; and a monitoring unit on the substrate transferring unit, the monitoring unit including a plurality of optical probes configured to measure reflected lights reflected from respective ones of a plurality of different positions of the substrate. The polishing unit, the cleaning unit, the drying unit, and the monitoring unit are sequentially located along the first direction.
-
公开(公告)号:US20200049496A1
公开(公告)日:2020-02-13
申请号:US16412706
申请日:2019-05-15
发明人: Seonghyeon CHEON
摘要: An apparatus for measuring thickness includes: a chamber; a sound wave transmitter transmitting a sound wave in the chamber; a sound wave receiver receiving the sound wave transmitted from the sound wave transmitter in the chamber; and a supporter between the sound wave transmitter and the sound wave receiver.
-