Invention Application
- Patent Title: DEVICE ISOLATION
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Application No.: US16605312Application Date: 2017-05-15
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Publication No.: US20200052117A1Publication Date: 2020-02-13
- Inventor: Rishabh Mehandru , Stephen M. Cea , Tahir Ghani
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- International Application: PCT/US2017/032609 WO 20170515
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L27/088 ; H01L29/786

Abstract:
Disclosed herein are structures and techniques for device isolation in integrated circuit (IC) assemblies. In some embodiments, an IC assembly may include multiple transistors spaced apart by an isolation region. The isolation region may include a doped semiconductor body whose dopant concentration is greatest at one or more surfaces, or may include a material that is lattice-mismatched with material of the transistors, for example.
Public/Granted literature
- US11264500B2 Device isolation Public/Granted day:2022-03-01
Information query
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