- 专利标题： SHEET-MOLDING COMPOUND AND FIBER-REINFORCED COMPOSITE MATERIAL
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申请号： US16654943申请日： 2019-10-16
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公开(公告)号： US20200055978A1公开(公告)日： 2020-02-20
- 发明人: Akira OOTA , Masahiro Ichino , Takuya Teranishi , Tooru Kondou , Mitsuru Kutsuwada
- 申请人： Mitsubishi Chemical Corporation
- 申请人地址： JP Chiyoda-ku
- 专利权人： Mitsubishi Chemical Corporation
- 当前专利权人： Mitsubishi Chemical Corporation
- 当前专利权人地址： JP Chiyoda-ku
- 优先权： JP2015-098607 20150513
- 主分类号： C08G59/24
- IPC分类号： C08G59/24 ; C08L63/00 ; C08L51/00 ; C08J5/24 ; C08K5/21 ; C08K5/315 ; C08K7/06 ; C08J5/04
摘要：
A sheet-molding compound comprising a thickened thermosetting resin composition and reinforcing fiber bundles. The thermosetting resin composition comprises components (A), (B) and (D). The content of component (D) is 10 parts by mass to 30 parts by mass with respect to 100 parts by mass of the total amount of epoxy resin. The final viscosity of the thickened thermosetting resin composition is 150 Pa·s to 20000 Pa·s, and the minimum viscosity is 2 Pa·s to 600 Pa·s, the final viscosity being higher than the minimum viscosity.