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公开(公告)号：US20220153923A1
公开(公告)日：2022-05-19
申请号：US17590252
申请日：2022-02-01
发明人： Takuya TERANISHI , Masahiro ICHINO , Kazuhisa IKEDA , Akira OOTA
IPC分类号： C08G59/50 , B32B5/26 , C08J5/24 , C08G59/30 , C08L63/00 , C08K7/04 , B32B27/38 , B29C43/20 , C08G59/56 , C08G59/18 , C08G59/40 , C08K7/02 , C08G59/62 , C08L63/04 , B29C70/34 , C08G59/22 , C08G59/24 , C08G59/28 , C08G59/54 , C08G59/60
摘要： A thermosetting resin composition (C) of which curing can be started at a relatively low temperature in a short time and a cured product exhibits high heat resistance, the thermosetting resin composition (C) comprising an epoxy resin; an epoxy resin curing agent; and an epoxy resin curing accelerator, wherein the epoxy resin curing agent contains an imidazole-based curing agent 1 which is not encapsulated in a microcapsule and a curing agent 2 which is encapsulated in a microcapsule, and the epoxy resin curing accelerator comprises a urea derivative.
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公开(公告)号：US20210009776A1
公开(公告)日：2021-01-14
申请号：US16925408
申请日：2020-07-10
发明人： Takuya TERANISHI , Satoshi OKAMOTO , Akira OOTA , Masahiro ICHINO
摘要： A prepreg contains: a reinforcing fiber material; and a resin composition with which the reinforcing fiber material is impregnated. The resin composition contains an epoxy resin, an amine curing agent, and an imidazole curing agent. An amount of the amine curing agent is less than or equal to 3.8 parts by mass, relative to 100 parts by mass of the epoxy resin, and a sum of the amount of the amine curing agent and an amount of the imidazole curing agent is less than or equal to 10 parts by mass, relative to 100 parts by mass of the epoxy resin. The fiber-reinforced composite material is a cured product of the prepreg.
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公开(公告)号：US20210198440A1
公开(公告)日：2021-07-01
申请号：US17202419
申请日：2021-03-16
发明人： Takuya TERANISHI , Masahiro ICHINO , Akira OOTA
IPC分类号： C08J5/24 , C08G65/24 , C08J5/04 , C08K5/3445 , C08L63/00
摘要： Provided is a thermosetting resin composition which achieves both high heat resistance and high bending strength as a fiber-reinforced composite material, and also has rapid curability that enables high cycle press forming, thermal stability, and storage stability. The thermosetting resin composition of the present invention is a thermosetting resin composition comprising an epoxy resin, an epoxy resin curing agent, an imidazole compound, and an epoxy resin curing accelerator, in which the epoxy resin curing agent is dicyandiamide or a derivative thereof, and the epoxy resin curing accelerator comprises a urea derivative having two or more dimethylureido groups in a molecule.
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公开(公告)号：US20210221969A1
公开(公告)日：2021-07-22
申请号：US17192103
申请日：2021-03-04
发明人： Akira OOTA , Hayato OGASAWARA
摘要： Provided is a sheet molding compound which can inhibit the formation of burrs during press molding, enables a matrix resin to exhibit excellent fluidity and excellent quick curing properties during press molding, and makes it possible to obtain a fiber-reinforced composite excellent in mold release properties, mechanical characteristics, and heat resistance. The sheet molding compound of the present invention contains an epoxy resin composition and reinforcing fiber, in which a gel time of the epoxy resin composition is 30 to 140 seconds at 140° C., a temperature at the start of curing reaction of the epoxy resin composition is 70° C. to 115° C., and when b1 represents a viscosity of the epoxy resin composition measured at 30° C. 7 days after the preparation of the composition, and b2 represents a viscosity of the epoxy resin composition measured at 30° C. 14 days after the preparation of the composition, b1 and b2 satisfy b2/b1≤5.
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公开(公告)号：US20180142057A1
公开(公告)日：2018-05-24
申请号：US15572820
申请日：2016-05-13
摘要： A sheet-molding compound comprising a thickened thermosetting resin composition and reinforcing fiber bundles. The thermosetting resin composition comprises components (A), (B) and (D). The content of component (D) is 10 parts by mass to 30 parts by mass with respect to 100 parts by mass of the total amount of epoxy resin. The final viscosity of the thickened thermosetting resin composition is 150 Pa·s to 20000 Pa·s, and the minimum viscosity is 2 Pa·s to 600 Pa·s, the final viscosity being higher than the minimum viscosity.
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公开(公告)号：US20220227951A1
公开(公告)日：2022-07-21
申请号：US17713704
申请日：2022-04-05
发明人： Takuya TERANISHI , Satoshi OKAMOTO , Akira OOTA , Masahiro ICHINO
摘要： A prepreg may include: a reinforcing fiber material including carbon fibers; and a resin composition with which the reinforcing fiber material is impregnated. The resin composition may include an epoxy resin (A), an amine curing agent (B), and an imidazole curing agent (C). The amine curing agent (B) may be present in a range of from 1 to 3.8 parts by mass, relative to 100 parts by mass of the epoxy resin (A). The amine curing agent (B) and the imidazole curing agent (C) may be present in a total amount of not more than 10 parts by mass, relative to 100 parts by mass of the epoxy resin (A). The imidazole curing agent may include an imidazole compound including, in its molecular structure, a triazine ring.
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公开(公告)号：US20200087506A1
公开(公告)日：2020-03-19
申请号：US16688716
申请日：2019-11-19
IPC分类号： C08L63/00 , C08G59/24 , C08G59/50 , C08G59/40 , C08K5/103 , C08K5/09 , C08K3/04 , C08K7/06 , B29C43/00 , C08J5/04
摘要： A molding material that enables acquirement of a fiber-reinforced composite material which has excellent demoldability from a mold and excellent surface appearance, which contaminates a mold surface after molding less, and which has excellent mechanical properties and heat resistance; and a fiber-reinforced composite material which has excellent demoldability from a mold and surface appearance, which contaminates a mold surface after molding less, and which has excellent mechanical properties and heat resistance, are provided. A molding material of the present invention includes a component (A): an epoxy resin; a component (B): an epoxy resin curing agent; a component (C): a compound that has a solubility parameter of 11.2 or less and a melting point of 115° C. or lower; and a reinforcement fiber.
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公开(公告)号：US20200055978A1
公开(公告)日：2020-02-20
申请号：US16654943
申请日：2019-10-16
摘要： A sheet-molding compound comprising a thickened thermosetting resin composition and reinforcing fiber bundles. The thermosetting resin composition comprises components (A), (B) and (D). The content of component (D) is 10 parts by mass to 30 parts by mass with respect to 100 parts by mass of the total amount of epoxy resin. The final viscosity of the thickened thermosetting resin composition is 150 Pa·s to 20000 Pa·s, and the minimum viscosity is 2 Pa·s to 600 Pa·s, the final viscosity being higher than the minimum viscosity.
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