Invention Application
- Patent Title: CONDUCTIVE LID AND SEMICONDUCTOR DEVICE PACKAGE
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Application No.: US16156984Application Date: 2018-10-10
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Publication No.: US20200118905A1Publication Date: 2020-04-16
- Inventor: Hsin-En CHEN
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/40 ; F28F13/06
Abstract:
A conductive lid includes a body including a first portion extended from the body and bent toward a first direction; a second portion extended from the body and bent toward the first direction; and a third portion extended from the second portion and bent toward a second direction different from the first direction.
Public/Granted literature
- US10685899B2 Conductive lid and semiconductor device package Public/Granted day:2020-06-16
Information query
IPC分类:
