Invention Application
- Patent Title: Source/Drain Features with an Etch Stop Layer
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Application No.: US16717426Application Date: 2019-12-17
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Publication No.: US20200126869A1Publication Date: 2020-04-23
- Inventor: Feng-Ching Chu , Wei-Yang Lee , Feng-Cheng Yang , Yen-Ming Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L21/02 ; H01L29/66 ; H01L29/167 ; H01L27/092 ; H01L21/265

Abstract:
The present disclosure provides a semiconductor device. The semiconductor device includes a substrate having a first device region and a second device region, a first fin over the substrate in the first device region, a second fin over the substrate in the second device region, a first epitaxial feature over the first fin in the source/drain region of the first fin, a second epitaxial feature over the second fin in the source/drain region of the second fin, and a dielectric layer on the first and second epitaxial features. The first epitaxial feature is doped with a first dopant of a first conductivity and the second epitaxial feature is doped with a second dopant of a second conductivity different from the first conductivity. The dielectric layer is doped with the first dopant.
Public/Granted literature
- US10748820B2 Source/drain features with an etch stop layer Public/Granted day:2020-08-18
Information query
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