Invention Application
- Patent Title: VACUUM-ASSISTED INCIDENTAL BUILD MATERIAL COLLECTION WITH RECEPTACLE IN THREE-DIMENSIONAL PRINTER
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Application No.: US16620362Application Date: 2017-07-31
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Publication No.: US20200147886A1Publication Date: 2020-05-14
- Inventor: Nicholas WANG , Michael CROCKETT , William WINTERS , Arthur H. BARNES , Wesley R. SCHALK , Justin M. ROMAN
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- International Application: PCT/US2017/044739 WO 20170731
- Main IPC: B29C64/35
- IPC: B29C64/35 ; B29C64/218 ; B29C64/357 ; B29C64/393 ; B33Y30/00 ; B33Y50/02 ; B33Y40/00 ; B29C64/321
Abstract:
The technology described herein includes a spreader that creates scattered incidental particles in a build chamber when spreading build material is applied in the build platform. One or more vacuum sources create negative pressure zones in one or more receptacles to collect the incidental particles in the build chamber during printing process and thus minimize the scattering of the incidental particles.
Information query
