Invention Application
- Patent Title: SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDUCTOR PACKAGE
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Application No.: US16743866Application Date: 2020-01-15
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Publication No.: US20200152479A1Publication Date: 2020-05-14
- Inventor: Wen-Sung Hsu , Ta-Jen Yu
- Applicant: MediaTek Inc.
- Applicant Address: TW Hsin-Chu
- Assignee: MediaTek Inc.
- Current Assignee: MediaTek Inc.
- Current Assignee Address: TW Hsin-Chu
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01F17/00 ; H05K3/30 ; H05K3/18 ; H05K3/10 ; H05K3/00 ; H05K1/18 ; H01L23/00 ; H01L23/498 ; H01L25/00 ; H01L23/66 ; H01L23/64 ; H01L23/538
Abstract:
The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a base. The base has a device-attach surface. A radio-frequency (RF) device is embedded in the base. The RF device is close to the device-attach surface.
Public/Granted literature
- US10916449B2 Semiconductor package and method for fabricating base for semiconductor package Public/Granted day:2021-02-09
Information query
IPC分类:
