A semiconductor package includes a connection structure including one or more redistribution layers, a semiconductor chip disposed on the connection structure and electrically connected to the one or more redistribution layers, an encapsulant disposed on the connection structure and covering at least a portion of the semiconductor chip, and a shielding structure covering at least a portion of the encapsulant. The shielding structure includes a conductive pattern layer having a plurality of openings, a first metal layer covering the conductive pattern layer and extending across the plurality of openings, and a second metal layer covering the first metal layer. The second metal layer has a thickness greater than a thickness of the first metal layer.