Invention Application
- Patent Title: IC Socket
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Application No.: US16682391Application Date: 2019-11-13
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Publication No.: US20200153140A1Publication Date: 2020-05-14
- Inventor: Shinichi Hashimoto , Masayuki Aizawa , Hiroshi Shirai , Naoki Hashimoto
- Applicant: Tyco Electronics Japan G.K.
- Applicant Address: JP Kawasaki
- Assignee: Tyco Electronics Japan G.K.
- Current Assignee: Tyco Electronics Japan G.K.
- Current Assignee Address: JP Kawasaki
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@27278a9a com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@759ad22e
- Main IPC: H01R13/11
- IPC: H01R13/11 ; H01R13/05 ; H01R13/15 ; H01R13/24

Abstract:
An integrated circuit socket includes a housing having a flat plate portion and a plurality of contacts disposed in the housing. The contacts each have a contact beam projecting outwardly from a first surface of the housing and a retained portion disposed in a passageway in the flat plate portion. The contact beam extends from the retained portion. The retained portion has a base portion with a flat-plate shape and a pair of side portions extending at an angle with respect to the base portion on a pair of opposite sides of the base portion. A cross-section of the retained portion parallel to the first surface has a U-shape.
Public/Granted literature
- US10978820B2 IC socket with contacts having a retained portion Public/Granted day:2021-04-13
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