Invention Application
- Patent Title: GAS INJECTION MODULE, SUBSTRATE PROCESSING APPARATUS, AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME
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Application No.: US16509946Application Date: 2019-07-12
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Publication No.: US20200157682A1Publication Date: 2020-05-21
- Inventor: MINKYU SUNG , SUNG-KI LEE , DOUGYONG SUNG , SANG-HO LEE , KANGMIN JEON
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5f04a42c
- Main IPC: C23C16/455
- IPC: C23C16/455 ; C23C16/509 ; H01J37/32 ; H01L21/683

Abstract:
A gas injection module includes a showerhead having first injection holes on a first region of the showerhead and second injection holes on a second region of the showerhead, the second region being outside the first region, a first distribution plate on the showerhead and having first and second upper passages respectively connected to the first and second injection holes, and a flow rate controller on the first and second upper passages of the first distribution plate. The flow rate controller reduces a difference in pressure within the first and second upper passages so that the gas may have similar flow rates within the first and second injection holes.
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