Invention Application
- Patent Title: SENSOR PACKAGE WITH INTEGRATED MAGNETIC SHIELD STRUCTURE
-
Application No.: US16191694Application Date: 2018-11-15
-
Publication No.: US20200158791A1Publication Date: 2020-05-21
- Inventor: Stephan Marauska , Dennis Helmboldt , Bernd Offermann , Thomas Hain
- Applicant: NXP B.V.
- Main IPC: G01R33/00
- IPC: G01R33/00 ; G01D5/16 ; H01L43/08 ; H01L43/12 ; H01L43/02

Abstract:
A sensor package includes a magnetic field sensor having first and second surfaces, the first surface being a sensing surface of the magnetic field sensor, a shield structure spaced apart from the magnetic field sensor, and a spacer interposed between the magnetic field sensor and the shield structure. The shield structure is configured to suppress stray magnetic fields in a plane parallel to first and second axes that are parallel to the sensing surface of the magnetic field sensor and perpendicular to one another. The shield structure may include a continuous sidewall having a central region, the spacer being surrounded by the continuous sidewall and the sensing surface of the magnetic field sensor being positioned outside of the central region. A system includes an encoder magnet and the sensor package, with the sensing surface of the magnetic field sensor facing the encoder magnet.
Information query