Invention Application
- Patent Title: HEATER PACKAGE
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Application No.: US16684597Application Date: 2019-11-15
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Publication No.: US20200163166A1Publication Date: 2020-05-21
- Inventor: Yen-Ching Kuo , Chien-Chang Hung , Hong-Ming Dai , Jane-Hway Liao , Hung-Yi Chen , Shu-Tang Yeh
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7cbcdb8d
- Main IPC: H05B3/36
- IPC: H05B3/36 ; H05B3/14 ; H05B3/03 ; H05B3/04

Abstract:
An embodiment of the disclosure provides a heater package including a substrate, a first barrier layer, at least one heater, and a second barrier layer. The first barrier layer is disposed on a surface of the substrate and has a first treatment layer on a side away from the substrate. The heater is disposed on the substrate and includes a heating layer and at least one electrode. The at least one electrode and the heating layer contact with each other. The second barrier layer covers an upper surface and a sidewall of the heater and has a second treatment layer on an opposite side or the side away from the substrate. A ratio of a thickness of the first treatment layer to a thickness of the first barrier layer and a ratio of a thickness of the second treatment layer to a thickness of the second barrier layer range from 0.03 to 0.2.
Public/Granted literature
- US11825570B2 Heater package Public/Granted day:2023-11-21
Information query