公开(公告)号：US10985297B2

公开(公告)日：2021-04-20

申请号：US16423131

申请日：2019-05-27

Applicant: Industrial Technology Research Institute ,  Intellectual Property Innovation Corporation

Inventor： Yen-Ching Kuo ,  Chien-Chang Hung ,  Jane-Hway Liao ,  Yi-Hsiang Huang ,  Shu-Tang Yeh ,  Hong-Ming Dai ,  Hung-Yi Chen

IPC: H01L33/56 ,  H01L33/50 ,  H01L33/60

Abstract: A package of photoelectric device including a substrate, at least one photoelectric device, a first barrier layer, a wavelength-converting layer, and a second barrier layer is provided. The photoelectric device is disposed on the substrate. The first barrier layer is disposed on the substrate and covers the photoelectric device. The wavelength-converting layer is disposed on the first barrier layer. The second barrier layer covers the wavelength-converting layer. A composition of the first barrier layer includes a nitrogen content of more than 0 atomic percent (at %) to 10 at %, an oxygen content of 50 at % to 70 at %, and a silicon content of 30 at % to 50 at %.

公开(公告)号：US10396256B2

公开(公告)日：2019-08-27

申请号：US15969790

申请日：2018-05-03

Applicant: Industrial Technology Research Institute ,  Intellectual Property Innovation Corporation

Inventor： Hsiao-Fen Wei ,  Kun-Lin Chuang ,  Yen-Ching Kuo ,  Kuan-Ting Chen

IPC: H01L23/28 ,  H01L33/52 ,  H01L23/00 ,  H01L51/52 ,  H01L27/32 ,  H01L33/48 ,  H01L23/29 ,  H01L23/31 ,  H01L51/44 ,  H01L33/56

Abstract: An electronic device package includes a substrate, an electronic device, and a first packaging layer. The electronic device and the first packaging layer are disposed on the substrate and the electronic device is located between the substrate and the first packaging layer. The first packaging layer includes a first oxynitride layer and a second oxynitride layer, wherein the second oxynitride layer is located between the first oxynitride layer and the electronic device. A composition of the first oxynitride layer includes SiNx1Oy1, a composition of the second oxynitride layer includes SiNx2Oy2, and x1>x2.

公开(公告)号：US20190058158A1

公开(公告)日：2019-02-21

申请号：US16104956

申请日：2018-08-20

Applicant: Industrial Technology Research Institute ,  Intellectual Property Innovation Corporation

Inventor： Hsiao-Fen Wei ,  Kun-Lin Chuang ,  Yen-Ching Kuo

IPC: H01L51/52 ,  H01L27/32 ,  H01L51/56

Abstract: A package of electronic device including a substrate, at least one electronic device and an encapsulation layer is provided. The substrate has a device area and a light transmitting area located outside the device area. The at least one electronic device is disposed on the device area of the substrate. The encapsulation layer is disposed on the substrate and covers the at least one electronic device. The encapsulation layer extends continuously from the device area to the light transmitting area, and a nitrogen content of the encapsulation layer on the device area is higher than a nitrogen content of the encapsulation layer on the light transmitting area. A display panel is also provided.

公开(公告)号：US11825570B2

公开(公告)日：2023-11-21

申请号：US16684597

申请日：2019-11-15

Applicant: Industrial Technology Research Institute

Inventor： Yen-Ching Kuo ,  Chien-Chang Hung ,  Hong-Ming Dai ,  Jane-Hway Liao ,  Hung-Yi Chen ,  Shu-Tang Yeh

IPC: H05B3/36 ,  H05B3/03 ,  H05B3/04 ,  H05B3/14

CPC classification number: H05B3/36 ,  H05B3/03 ,  H05B3/04 ,  H05B3/146 ,  H05B2203/017

Abstract: An embodiment of the disclosure provides a heater package including a substrate, a first barrier layer, at least one heater, and a second barrier layer. The first barrier layer is disposed on a surface of the substrate and has a first treatment layer on a side away from the substrate. The heater is disposed on the substrate and includes a heating layer and at least one electrode. The at least one electrode and the heating layer contact with each other. The second barrier layer covers an upper surface and a sidewall of the heater and has a second treatment layer on an opposite side or the side away from the substrate. A ratio of a thickness of the first treatment layer to a thickness of the first barrier layer and a ratio of a thickness of the second treatment layer to a thickness of the second barrier layer range from 0.03 to 0.2.

公开(公告)号：US11551829B2

公开(公告)日：2023-01-10

申请号：US17466872

申请日：2021-09-03

Applicant: Industrial Technology Research Institute

Inventor： Hung-Yi Chen ,  Yen-Ching Kuo ,  Hong-Ming Dai ,  Shu-Tang Yeh ,  Wen-Lung Chen ,  Jane-Hway Liao

IPC: G09F9/30 ,  H01B7/04

Abstract: The disclosure provides an electronic device. The electronic device includes a stretchable substrate, a plurality of electronic elements, and at least one connection element. The electronic elements and the connection element are disposed on the stretchable substrate. The connection element is disposed between two adjacent electronic elements, and the two adjacent electronic elements are electrically connected to each other via the connection element. Each electronic element may include at least one functional unit and an electrode, wherein the electrode is in direct contact with the functional unit. The connecting element includes at least one stretchable conductive unit and at least one buffer conductive unit, wherein the buffer conductive unit contacts the electrode, and the stretchable conductive unit is electrically connected to the electrode through the buffer conductive unit. The yield strain of the stretchable conductive unit is greater than the yield strain of the buffer conductive unit.

公开(公告)号：US20200163166A1

公开(公告)日：2020-05-21

申请号：US16684597

申请日：2019-11-15

Applicant: Industrial Technology Research Institute

Inventor： Yen-Ching Kuo ,  Chien-Chang Hung ,  Hong-Ming Dai ,  Jane-Hway Liao ,  Hung-Yi Chen ,  Shu-Tang Yeh

IPC: H05B3/36 ,  H05B3/14 ,  H05B3/03 ,  H05B3/04

Abstract: An embodiment of the disclosure provides a heater package including a substrate, a first barrier layer, at least one heater, and a second barrier layer. The first barrier layer is disposed on a surface of the substrate and has a first treatment layer on a side away from the substrate. The heater is disposed on the substrate and includes a heating layer and at least one electrode. The at least one electrode and the heating layer contact with each other. The second barrier layer covers an upper surface and a sidewall of the heater and has a second treatment layer on an opposite side or the side away from the substrate. A ratio of a thickness of the first treatment layer to a thickness of the first barrier layer and a ratio of a thickness of the second treatment layer to a thickness of the second barrier layer range from 0.03 to 0.2.

公开(公告)号：US20190058094A1

公开(公告)日：2019-02-21

申请号：US15969790

申请日：2018-05-03

Applicant: Industrial Technology Research Institute ,  Intellectual Property Innovation Corporation

Inventor： Hsiao-Fen Wei ,  Kun-Lin Chuang ,  Yen-Ching Kuo ,  Kuan-Ting Chen

IPC: H01L33/52 ,  H01L23/00 ,  H01L33/48 ,  H01L27/32 ,  H01L51/52

CPC classification number: H01L33/52 ,  H01L23/291 ,  H01L23/3135 ,  H01L23/564 ,  H01L27/326 ,  H01L33/483 ,  H01L33/56 ,  H01L51/448 ,  H01L51/52 ,  H01L51/5256

Abstract: An electronic device package includes a substrate, an electronic device, and a first packaging layer. The electronic device and the first packaging layer are disposed on the substrate and the electronic device is located between the substrate and the first packaging layer. The first packaging layer includes a first oxynitride layer and a second oxynitride layer, wherein the second oxynitride layer is located between the first oxynitride layer and the electronic device. A composition of the first oxynitride layer includes SiNx1Oy1, a composition of the second oxynitride layer includes SiNx2Oy2, and x1>x2.