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    PACKAGE STRUCTURE OF ELECTRONIC DEVICE
    3.
    发明申请
    PACKAGE STRUCTURE OF ELECTRONIC DEVICE 审中-公开
    电子设备的包装结构

    公开(公告)号：US20160174366A1

    公开(公告)日：2016-06-16

    申请号：US15051645

    申请日：2016-02-23

    Applicant: Industrial Technology Research Institute

    Inventor： Shu-Tang Yeh ,  Chia-Hao Tsai ,  Mei-Ru Lin

    IPC: H05K1/02 ,  H05K1/18

    CPC classification number: H05K1/0274 ,  H05K1/183 ,  H05K5/064

    Abstract: A package structure of an electronic device includes a first substrate, a second substrate, an electronic device and a first barrier structure. The first substrate includes a first light-transmitting portion and a periphery portion. The second substrate includes a second light-transmitting portion and two covering portions located on two sides of the second light-transmitting portion. The first light-transmitting portion is disposed corresponding to the second light-transmitting portion, and a device disposition region exists therebetween. The covering portions cover the periphery portion of the first substrate and two opposite side surfaces of the first substrate. The electronic device is disposed on the first or second substrate, and is located in the device disposition region. The first barrier structure disposed on the first substrate or the second substrate is disposed corresponding to the periphery portion and disposed on at least one side of the device disposition region.

    Abstract translation: 电子器件的封装结构包括第一衬底，第二衬底，电子器件和第一屏障结构。 第一基板包括第一透光部分和周边部分。 第二基板包括第二透光部分和位于第二光透射部分两侧的两个覆盖部分。 第一光透射部分对应于第二光透射部分设置，并且在其间存在器件配置区域。 覆盖部分覆盖第一基板的周边部分和第一基板的两个相对的侧表面。 电子设备设置在第一或第二基板上，并且位于设备配置区域中。 设置在第一基板或第二基板上的第一阻挡结构相对于周边部分设置并设置在装置配置区域的至少一侧。

    ENVIRONMENTAL SENSITIVE ELECTRONIC DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
    5.
    发明申请
    ENVIRONMENTAL SENSITIVE ELECTRONIC DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF 有权
    环境敏感电子设备包装及其制造方法

    公开(公告)号：US20140160710A1

    公开(公告)日：2014-06-12

    申请号：US14098551

    申请日：2013-12-06

    Applicant: Industrial Technology Research Institute

    Inventor： Jing-Yi Yan ,  Shu-Tang Yeh ,  Sheng-Wei Chen ,  Kuang-Jung Chen

    IPC: H05K7/02 ,  H05K3/30

    CPC classification number: H05K3/30 ,  G02F1/133308 ,  G02F2001/133311 ,  G02F2202/28 ,  H01L51/5246 ,  H01L51/5259 ,  Y10T29/49128

    Abstract: An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, a side wall barrier structure, a first adhesive, and a second adhesive is provided. The environmental sensitive electronic device is located on the first substrate. The first adhesive is located on the first substrate. The side wall barrier structure is located on the first adhesive, and the side wall barrier structure is adhered to the first substrate through the first adhesive. The second adhesive is located on the side wall barrier structure. The side wall barrier structure is adhered to the second substrate through the second adhesive, and the side wall barrier structure, the first adhesive, and the second adhesive are located between the first substrate and the second substrate. A manufacturing method of an environmental sensitive electronic device package is also provided.

    Abstract translation: 提供了包括第一基板，第二基板，环境敏感电子设备，侧壁阻挡结构，第一粘合剂和第二粘合剂的环境敏感的电子设备封装。 环境敏感电子设备位于第一基板上。 第一粘合剂位于第一基底上。 侧壁阻挡结构位于第一粘合剂上，并且侧壁阻挡结构通过第一粘合剂粘附到第一基底。 第二粘合剂位于侧壁阻挡结构上。 侧壁阻挡结构通过第二粘合剂粘附到第二基板，并且侧壁阻挡结构，第一粘合剂和第二粘合剂位于第一基板和第二基板之间。 还提供了一种环境敏感电子设备封装的制造方法。

    HEATER PACKAGE
    6.
    发明申请
    HEATER PACKAGE 审中-公开

    公开(公告)号：US20200163166A1

    公开(公告)日：2020-05-21

    申请号：US16684597

    申请日：2019-11-15

    Applicant: Industrial Technology Research Institute

    Inventor： Yen-Ching Kuo ,  Chien-Chang Hung ,  Hong-Ming Dai ,  Jane-Hway Liao ,  Hung-Yi Chen ,  Shu-Tang Yeh

    IPC: H05B3/36 ,  H05B3/14 ,  H05B3/03 ,  H05B3/04

    Abstract: An embodiment of the disclosure provides a heater package including a substrate, a first barrier layer, at least one heater, and a second barrier layer. The first barrier layer is disposed on a surface of the substrate and has a first treatment layer on a side away from the substrate. The heater is disposed on the substrate and includes a heating layer and at least one electrode. The at least one electrode and the heating layer contact with each other. The second barrier layer covers an upper surface and a sidewall of the heater and has a second treatment layer on an opposite side or the side away from the substrate. A ratio of a thickness of the first treatment layer to a thickness of the first barrier layer and a ratio of a thickness of the second treatment layer to a thickness of the second barrier layer range from 0.03 to 0.2.

    Heater package
    8.
    发明授权
    Heater package 有权

    公开(公告)号：US11825570B2

    公开(公告)日：2023-11-21

    申请号：US16684597

    申请日：2019-11-15

    Applicant: Industrial Technology Research Institute

    Inventor： Yen-Ching Kuo ,  Chien-Chang Hung ,  Hong-Ming Dai ,  Jane-Hway Liao ,  Hung-Yi Chen ,  Shu-Tang Yeh

    IPC: H05B3/36 ,  H05B3/03 ,  H05B3/04 ,  H05B3/14

    CPC classification number: H05B3/36 ,  H05B3/03 ,  H05B3/04 ,  H05B3/146 ,  H05B2203/017

    Abstract: An embodiment of the disclosure provides a heater package including a substrate, a first barrier layer, at least one heater, and a second barrier layer. The first barrier layer is disposed on a surface of the substrate and has a first treatment layer on a side away from the substrate. The heater is disposed on the substrate and includes a heating layer and at least one electrode. The at least one electrode and the heating layer contact with each other. The second barrier layer covers an upper surface and a sidewall of the heater and has a second treatment layer on an opposite side or the side away from the substrate. A ratio of a thickness of the first treatment layer to a thickness of the first barrier layer and a ratio of a thickness of the second treatment layer to a thickness of the second barrier layer range from 0.03 to 0.2.

    Electronic device
    9.
    发明授权
    Electronic device 有权

    公开(公告)号：US11551829B2

    公开(公告)日：2023-01-10

    申请号：US17466872

    申请日：2021-09-03

    Applicant: Industrial Technology Research Institute

    Inventor： Hung-Yi Chen ,  Yen-Ching Kuo ,  Hong-Ming Dai ,  Shu-Tang Yeh ,  Wen-Lung Chen ,  Jane-Hway Liao

    IPC: G09F9/30 ,  H01B7/04

    Abstract: The disclosure provides an electronic device. The electronic device includes a stretchable substrate, a plurality of electronic elements, and at least one connection element. The electronic elements and the connection element are disposed on the stretchable substrate. The connection element is disposed between two adjacent electronic elements, and the two adjacent electronic elements are electrically connected to each other via the connection element. Each electronic element may include at least one functional unit and an electrode, wherein the electrode is in direct contact with the functional unit. The connecting element includes at least one stretchable conductive unit and at least one buffer conductive unit, wherein the buffer conductive unit contacts the electrode, and the stretchable conductive unit is electrically connected to the electrode through the buffer conductive unit. The yield strain of the stretchable conductive unit is greater than the yield strain of the buffer conductive unit.

    Package structure of electronic device
    10.
    发明授权
    Package structure of electronic device 有权

    公开(公告)号：US09795028B2

    公开(公告)日：2017-10-17

    申请号：US15051645

    申请日：2016-02-23

    Applicant: Industrial Technology Research Institute

    Inventor： Shu-Tang Yeh ,  Chia-Hao Tsai ,  Mei-Ru Lin

    IPC: H05K1/02 ,  H05K5/06 ,  H05K1/18

    CPC classification number: H05K1/0274 ,  H05K1/183 ,  H05K5/064

    Abstract: A package structure of an electronic device includes a first substrate, a second substrate, an electronic device and a first barrier structure. The first substrate includes a first light-transmitting portion and a periphery portion. The second substrate includes a second light-transmitting portion and two covering portions located on two sides of the second light-transmitting portion. The first light-transmitting portion is disposed corresponding to the second light-transmitting portion, and a device disposition region exists therebetween. The covering portions cover the periphery portion of the first substrate and two opposite side surfaces of the first substrate. The electronic device is disposed on the first or second substrate, and is located in the device disposition region. The first barrier structure disposed on the first substrate or the second substrate is disposed corresponding to the periphery portion and disposed on at least one side of the device disposition region.

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