Invention Application
- Patent Title: LIQUID COOLING DISTRIBUTION IN A MODULAR ELECTRONIC SYSTEM
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Application No.: US16749254Application Date: 2020-01-22
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Publication No.: US20200163251A1Publication Date: 2020-05-21
- Inventor: Rakesh Chopra , Mandy Hin Lam , M. Baris Dogruoz , Joel Richard Goergen
- Applicant: CISCO TECHNOLOGY, INC.
- Applicant Address: US CA San Jose
- Assignee: CISCO TECHNOLOGY, INC.
- Current Assignee: CISCO TECHNOLOGY, INC.
- Current Assignee Address: US CA San Jose
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
In one embodiment, a network communications device includes a chassis, a plurality of modules removably inserted into a plurality of slots in the chassis, at least a portion of the modules each comprising a connector for receiving coolant for cooling components on the module, a controller for controlling coolant distribution to the modules, and a leak detection system for identifying a leak of the coolant and transmitting an indication of the leak to the controller.
Public/Granted literature
- US11191185B2 Liquid cooling distribution in a modular electronic system Public/Granted day:2021-11-30
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