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公开(公告)号:US20200275587A1
公开(公告)日:2020-08-27
申请号:US16282127
申请日:2019-02-21
Applicant: CISCO TECHNOLOGY, INC.
Inventor: Rakesh Chopra , Mandy Hin Lam
Abstract: In one embodiment, an optical module cage includes a first opening for slidably receiving an optical module, a second opening positioned adjacent to the first opening for slidably receiving a riding heatsink separate from the optical module or an integrated heatsink connected to the optical module, and a guide rail interposed between the first opening and the second opening, wherein the guide rail is configured to support the riding heatsink and not interfere with insertion of the integrated heatsink.
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公开(公告)号:US20200163251A1
公开(公告)日:2020-05-21
申请号:US16749254
申请日:2020-01-22
Applicant: CISCO TECHNOLOGY, INC.
Inventor: Rakesh Chopra , Mandy Hin Lam , M. Baris Dogruoz , Joel Richard Goergen
IPC: H05K7/20
Abstract: In one embodiment, a network communications device includes a chassis, a plurality of modules removably inserted into a plurality of slots in the chassis, at least a portion of the modules each comprising a connector for receiving coolant for cooling components on the module, a controller for controlling coolant distribution to the modules, and a leak detection system for identifying a leak of the coolant and transmitting an indication of the leak to the controller.
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公开(公告)号:US20160128230A1
公开(公告)日:2016-05-05
申请号:US14531615
申请日:2014-11-03
Applicant: CISCO TECHNOLOGY, INC.
Inventor: Mandy Hin Lam , Hong Tran Huynh , Vic Hong Chia , M. Baris Dogruoz
CPC classification number: H05K7/20727 , H05K9/0062
Abstract: A faceplate of a line card is provided, and in one example embodiment, includes a top panel including a portion angled downward towards a front side of the faceplate, the angled portion having a plurality of holes, and a front panel disposed on the front side of the faceplate, attached to the angled portion of the top panel on its top side and having a beveled edge at its bottom side, the angled portion of the top panel and the beveled edge of the front panel facilitating an intake area for air flow between the line card and other parallel line cards assembled on a chassis. In specific embodiments, the plurality of holes are arranged in a honeycomb pattern with each hole comprising a Reuleaux hexagon having rounded corners.
Abstract translation: 提供线卡的面板,并且在一个示例性实施例中,包括顶板,其包括朝向所述面板的前侧向下倾斜的部分,所述成角度部分具有多个孔,以及设置在所述前侧上的前面板 连接到顶板的顶部的倾斜部分并且在其底侧具有倾斜边缘,顶板的倾斜部分和前面板的倾斜边缘有助于进入空气流的进入区域 线卡和其他平行线卡组装在机箱上。 在具体实施例中,多个孔布置成蜂窝图案,每个孔包括具有圆角的Reuleaux六边形。
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公开(公告)号:US12200906B2
公开(公告)日:2025-01-14
申请号:US17503875
申请日:2021-10-18
Applicant: Cisco Technology, Inc.
Inventor: Rakesh Chopra , Mandy Hin Lam , M. Baris Dogruoz , Joel Richard Goergen
IPC: H05K7/20
Abstract: A network communications device includes a chassis, a plurality of modules removably inserted into a plurality of slots in the chassis. A coolant is delivered to a first group of the plurality of modules with a first flow control valve in a first cooling loop and the coolant is delivered to a second group of the plurality of modules with a second flow control valve in a second cooling loop. The network communication device further includes a plurality of sensors for monitoring a temperature in the first cooling loop and the second cooling loop and a control system for controlling delivery of the coolant to the first group and the second group, where the control system controls transmitting a signal to one of the first flow control valve and the second flow control valve to modify a flow of the coolant.
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公开(公告)号:US11917793B2
公开(公告)日:2024-02-27
申请号:US17145816
申请日:2021-01-11
Applicant: CISCO TECHNOLOGY, INC.
Inventor: Mark Nowell , M. Baris Dogruoz , Mandy Hin Lam , Rakesh Chopra
CPC classification number: H05K7/20236 , G06F1/20 , H01L23/44
Abstract: In one embodiment, an apparatus is configured for insertion into a network device and includes a printed circuit board, at least one electronic component mounted on the printed circuit board and configured for direct air-cooling, and an enclosure comprising a plurality of electronic components, an electrical connector, a fluid inlet connector, and a fluid outlet connector. A dielectric liquid is disposed within the enclosure for immersion cooling of said plurality of electronic components during operation of the network device.
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公开(公告)号:US11647607B2
公开(公告)日:2023-05-09
申请号:US17156085
申请日:2021-01-22
Applicant: CISCO TECHNOLOGY, INC.
Inventor: M. Baris Dogruoz , Mark Nowell , Yi Tang , Rakesh Chopra , Mandy Hin Lam
CPC classification number: H05K7/20236 , H05K1/0203 , H05K1/0272 , H05K7/2089 , H05K7/20627 , H05K7/20636 , H05K2201/064
Abstract: In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.
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公开(公告)号:US11523541B2
公开(公告)日:2022-12-06
申请号:US16928279
申请日:2020-07-14
Applicant: Cisco Technology, Inc.
Inventor: M. Baris Dogruoz , Mandy Hin Lam , Mark Nowell , Rakesh Chopra
IPC: H05K7/20 , F28F13/00 , G02B6/42 , H01R13/514
Abstract: Presented herein is a plurality of arrangements of cold plates having interior chambers. The interior chamber includes a plurality of fins with a first fin zone and a second fin zone. The cold plate further includes a first fluid inlet and a first fluid outlet. The cold plates can be connected such that each cold plate allows unidirectional flow or counter flow configurations. Unidirectional flow or counter flow cold plates can be arranged in rows and in combination of rows.
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公开(公告)号:US20220039291A1
公开(公告)日:2022-02-03
申请号:US17503875
申请日:2021-10-18
Applicant: Cisco Technology, Inc.
Inventor: Rakesh Chopra , Mandy Hin Lam , M. Baris Dogruoz , Joel Richard Goergen
IPC: H05K7/20
Abstract: A network communications device includes a chassis, a plurality of modules removably inserted into a plurality of slots in the chassis. A coolant is delivered to a first group of the plurality of modules with a first flow control valve in a first cooling loop and the coolant is delivered to a second group of the plurality of modules with a second flow control valve in a second cooling loop. The network communication device further includes a plurality of sensors for monitoring a temperature in the first cooling loop and the second cooling loop and a control system for controlling delivery of the coolant to the first group and the second group, where the control system controls transmitting a signal to one of the first flow control valve and the second flow control valve to modify a flow of the coolant.
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公开(公告)号:US10285291B1
公开(公告)日:2019-05-07
申请号:US15898576
申请日:2018-02-17
Applicant: CISCO TECHNOLOGY, INC.
Inventor: Mandy Hin Lam , Vic Hong Chia , Keith Frank Tharp
IPC: H01R13/62 , H05K5/02 , H01R13/629 , G06K13/08 , G11B33/12
Abstract: In one embodiment, an apparatus includes a line card ejector configured to engage with a chassis to retain the line card within a slot in the chassis in a closed position, a locking member movable between a locked position in which the ejector is locked in its closed position and an unlocked position in which the ejector may be moved to an open position to remove the line card from the chassis, and an actuation device for moving the locking member from its locked position to its unlocked position. The locking member comprises an accessible release lever for moving the locking member from its locked position to its unlocked position without use of the actuation device for emergency release and removal of the line card. A method for emergency release of the line card is also disclosed herein.
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公开(公告)号:US20230209767A1
公开(公告)日:2023-06-29
申请号:US18178686
申请日:2023-03-06
Applicant: Cisco Technology, Inc.
Inventor: M. Baris Dogruoz , Mark Nowell , Yi Tang , Rakesh Chopra , Mandy Hin Lam
CPC classification number: H05K7/20236 , H05K1/0203 , H05K1/0272 , H05K7/20627 , H05K7/2089 , H05K2201/064 , H05K7/20636
Abstract: In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.
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