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    OPTICAL MODULE CAGES MOUNTED FOR OPTIMAL DENSITY AND COOLING
    1.
    发明公开
    OPTICAL MODULE CAGES MOUNTED FOR OPTIMAL DENSITY AND COOLING 审中-公开

    公开(公告)号：US20230221510A1

    公开(公告)日：2023-07-13

    申请号：US18187152

    申请日：2023-03-21

    Applicant: Cisco Technology, Inc.

    Inventor： Joel Richard Goergen ,  Paolo Sironi ,  Giovanni Giobbio ,  M. Baris Dogruoz

    IPC: G02B6/42 ,  H05K7/20

    CPC classification number: G02B6/4261 ,  G02B6/4269 ,  H05K7/2039

    Abstract: A housing for an electronic device includes a panel, where the panel includes a window. A cage includes a plurality of panels and a first end and a second end that opposes the first end. The cage further includes an opening at its first end and an enclosure disposed between the panels of the cage. Connecting structure is disposed at the first end of the cage, where the connecting structure secures the first end of the cage to the panel. The cage is suitably dimensioned to receive and retain a portion of a pluggable module within the enclosure when the pluggable module is inserted within the opening at the first end of the cage.

    OPTICAL MODULE CAGES MOUNTED FOR OPTIMAL DENSITY AND COOLING
    2.
    发明申请
    OPTICAL MODULE CAGES MOUNTED FOR OPTIMAL DENSITY AND COOLING 有权

    公开(公告)号：US20220244472A1

    公开(公告)日：2022-08-04

    申请号：US17528415

    申请日：2021-11-17

    Applicant: Cisco Technology, Inc.

    Inventor： Joel Richard Goergen ,  Paolo Sironi ,  Giovanni Giobbio ,  M. Baris Dogruoz

    IPC: G02B6/42

    Abstract: A housing for an electronic device includes a panel, where the panel includes a window. A cage includes a plurality of panels and a first end and a second end that opposes the first end. The cage further includes an opening at its first end and an enclosure disposed between the panels of the cage. Connecting structure is disposed at the first end of the cage, where the connecting structure secures the first end of the cage to the panel. The cage is suitably dimensioned to receive and retain a portion of an optical module within the enclosure when the optical module is inserted within the opening at the first end of the cage.

    COMBINED LIQUID AND AIR COOLING SYSTEM FOR FAIL-SAFE OPERATION OF HIGH POWER DENSITY ASIC DEVICES
    3.
    发明申请
    COMBINED LIQUID AND AIR COOLING SYSTEM FOR FAIL-SAFE OPERATION OF HIGH POWER DENSITY ASIC DEVICES 有权

    公开(公告)号：US20220240419A1

    公开(公告)日：2022-07-28

    申请号：US17720436

    申请日：2022-04-14

    Applicant: Cisco Technology, Inc.

    Inventor： M. Baris Dogruoz ,  Joel Goergen

    IPC: H05K7/20 ,  H05K1/02

    Abstract: A combined liquid and air cooling system is provided over a printed circuit board (PCB) of an electronic device, where the PCB includes an integrated circuit package including an application specific integrated circuit (ASIC) die and a plurality of high bandwidth memory (HBM) modules located proximate the ASIC die, and the combined liquid and air cooling system includes a liquid cooling system located over the integrated circuit package and an air cooling system integrated with the liquid cooling system and a portion of the PCB. The system operates in a normal mode, where both liquid and air cooling systems provide cooling to components of the PCB, and a fail-safe mode, where the liquid cooling system is not operating (e.g., due to a detected condition) but the air cooling system operation is adjusted such that it provides sufficient cooling to PCB components which facilitates continuous operation of the electronic device.

    LIQUID COOLING DISTRIBUTION IN A MODULAR ELECTRONIC SYSTEM
    5.
    发明申请
    LIQUID COOLING DISTRIBUTION IN A MODULAR ELECTRONIC SYSTEM 审中-公开

    公开(公告)号：US20200163251A1

    公开(公告)日：2020-05-21

    申请号：US16749254

    申请日：2020-01-22

    Applicant: CISCO TECHNOLOGY, INC.

    Inventor： Rakesh Chopra ,  Mandy Hin Lam ,  M. Baris Dogruoz ,  Joel Richard Goergen

    IPC: H05K7/20

    Abstract: In one embodiment, a network communications device includes a chassis, a plurality of modules removably inserted into a plurality of slots in the chassis, at least a portion of the modules each comprising a connector for receiving coolant for cooling components on the module, a controller for controlling coolant distribution to the modules, and a leak detection system for identifying a leak of the coolant and transmitting an indication of the leak to the controller.

    Multi-Input Line-Redundant Uninterruptable Power Supply
    6.
    发明申请
    Multi-Input Line-Redundant Uninterruptable Power Supply 审中-公开

    公开(公告)号：US20170201122A1

    公开(公告)日：2017-07-13

    申请号：US15399765

    申请日：2017-01-06

    Applicant: Cisco Technology, Inc.

    Inventor： Douglas P. Arduini ,  Sung Kee Baek ,  Richard Anthony O'Brien ,  John Beecroft ,  M. Baris Dogruoz

    IPC: H02J9/06 ,  H02M7/04 ,  H02M3/04

    CPC classification number: H02J9/061 ,  H02M3/04 ,  H02M7/04 ,  H02M2001/007

    Abstract: A power supply system may comprise a plurality of input buses and an output bus. A plurality of multi-input power supplies may be disposed between the plurality of input buses and the output bus. The plurality of multi-input power supplies may be configured to supply a predetermined amount of power to the output bus before and after a failure event. The failure event may comprise at least one of the following: a failure of a one of the plurality of multi-input power supplies and loss of power on one of the plurality of input buses. Each input to the power supply may include an independent power section to support near or full output power in the event of another input power loss. Any input line loss from an independent power bus/grid may provide line redundancy to the power supply and to the power system as an Uninterruptable Power Supply.

    DOUBLE-ANGLED FACEPLATE FOR AIR FLOW SYSTEM
    7.
    发明申请
    DOUBLE-ANGLED FACEPLATE FOR AIR FLOW SYSTEM 审中-公开
    用于空气流动系统的双重特征

    公开(公告)号：US20160128230A1

    公开(公告)日：2016-05-05

    申请号：US14531615

    申请日：2014-11-03

    Applicant: CISCO TECHNOLOGY, INC.

    Inventor： Mandy Hin Lam ,  Hong Tran Huynh ,  Vic Hong Chia ,  M. Baris Dogruoz

    IPC: H05K7/20 ,  H05K7/14

    CPC classification number: H05K7/20727 ,  H05K9/0062

    Abstract: A faceplate of a line card is provided, and in one example embodiment, includes a top panel including a portion angled downward towards a front side of the faceplate, the angled portion having a plurality of holes, and a front panel disposed on the front side of the faceplate, attached to the angled portion of the top panel on its top side and having a beveled edge at its bottom side, the angled portion of the top panel and the beveled edge of the front panel facilitating an intake area for air flow between the line card and other parallel line cards assembled on a chassis. In specific embodiments, the plurality of holes are arranged in a honeycomb pattern with each hole comprising a Reuleaux hexagon having rounded corners.

    Abstract translation: 提供线卡的面板，并且在一个示例性实施例中，包括顶板，其包括朝向所述面板的前侧向下倾斜的部分，所述成角度部分具有多个孔，以及设置在所述前侧上的前面板 连接到顶板的顶部的倾斜部分并且在其底侧具有倾斜边缘，顶板的倾斜部分和前面板的倾斜边缘有助于进入空气流的进入区域 线卡和其他平行线卡组装在机箱上。 在具体实施例中，多个孔布置成蜂窝图案，每个孔包括具有圆角的Reuleaux六边形。

    Air cooled cage design
    10.
    发明授权
    Air cooled cage design 有权

    公开(公告)号：US11357132B2

    公开(公告)日：2022-06-07

    申请号：US16922177

    申请日：2020-07-07

    Applicant: Cisco Technology, Inc.

    Inventor： Rakesh Chopra ,  M. Baris Dogruoz ,  Mark Nowell ,  Mandy Hin Lam

    IPC: H05K7/20 ,  H05K7/14 ,  G02B6/42 ,  H01R13/518

    Abstract: Presented herein are optical module cage designs and heatsink configurations for improved air cooling of pluggable optical modules disposed within the optical module cages. The designs and configurations presented herein facilitate efficient air cooling of higher power pluggable optical modules by enhancing airflow through the optical module cages, increasing contact between the optical modules and the heatsinks, and/or increasing the heatsink dissipation surface area.

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