Invention Application
- Patent Title: MULTIPLE-SURFACE CONNECTED EMBEDDED INTERCONNECT BRIDGE FOR SEMICONDUCTOR PACKAGE SUBSTRATES
-
Application No.: US16662990Application Date: 2019-10-24
-
Publication No.: US20200168538A1Publication Date: 2020-05-28
- Inventor: Jenny Shio Yin Ong , Seok Ling Lim , Bok Eng Cheah , Jackson Chung Peng Kong
- Applicant: Intel Corporation
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7fb4438
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/495 ; H01L23/48 ; H01L23/522 ; H01L23/00
Abstract:
An embedded interconnect bridge includes a backside trace that can be coupled to a power plane within a semiconductor package substrate. The embedded interconnect bridge-backside trace preserves useful package real estate that is near to where multiple dice are to be mounted on the semiconductor package substrate.
Information query
IPC分类:
