A heating apparatus for thermally processing a part includes a table formed of a thermally conductive material and a table inductive heating circuit thermally coupled to the table. The table inductive heating circuit comprising a plurality of table induction coil circuits electrically coupled in parallel with each other. Each table induction coil circuit includes a table electrical conductor and a table smart susceptor having a Curie temperature. First and second table induction coil circuits have pairs of segments positioned adjacent each other that are configured to carry current in opposite directions. In some examples, the table induction coil circuits have partially nested, rectilinear hook shapes. In other examples, the table induction coil circuits overlap each other at rhombus-shaped turns.