- 专利标题： COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING
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申请号： US16742085申请日： 2020-01-14
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公开(公告)号： US20200173029A1公开(公告)日： 2020-06-04
- 发明人: Cornelia ROEGER-GOEPFERT , Roman Benedikt RAETHER , Charlotte EMNET , Alexandra HAAG , Dieter MAYER
- 申请人： BASF SE
- 申请人地址： DE Ludwigshafen
- 专利权人： BASF SE
- 当前专利权人： BASF SE
- 当前专利权人地址： DE Ludwigshafen
- 优先权： com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@62f906e6
- 主分类号： C23C18/31
- IPC分类号： C23C18/31 ; C25D3/38 ; H01L21/288 ; C23C18/32 ; C25D3/58 ; H01L21/768
摘要：
Composition comprising a source of metal ions and at least one suppressing agent obtainable by reacting a) an amine compound comprising at least three active amino functional groups with b) a mixture of ethylene oxide and at least one compound selected from C3 and C4 alkylene oxides.
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