Invention Application
- Patent Title: PRINTED CIRCUIT BOARD AND PACKAGE HAVING THE SAME
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Application No.: US16676493Application Date: 2019-11-07
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Publication No.: US20200178401A1Publication Date: 2020-06-04
- Inventor: Tae-Hong MIN , Ju-Ho KIM
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@21373c08
- Main IPC: H05K3/46
- IPC: H05K3/46 ; H05K1/14 ; H05K3/22
Abstract:
A printed circuit board including: a laminate having a plurality of stacked insulating layers including a rigid insulating layer; a flexible insulating layer having a partial region that overlaps and is in contact with at least one of the insulating layers and a remaining region disposed outside of the laminate; and a first antenna disposed on a surface of the laminate.
Public/Granted literature
- US11122694B2 Printed circuit board and package having the same Public/Granted day:2021-09-14
Information query
