Invention Application
- Patent Title: EXPANSION APPARATUS, SHAPING SYSTEM, AND MANUFACTURING METHOD OF SHAPED OBJECT
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Application No.: US16689138Application Date: 2019-11-20
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Publication No.: US20200180212A1Publication Date: 2020-06-11
- Inventor: Yuji HORIUCHI , Kenji IWAMOTO
- Applicant: CASIO COMPUTER CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: CASIO COMPUTER CO., LTD.
- Current Assignee: CASIO COMPUTER CO., LTD.
- Current Assignee Address: JP Tokyo
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@58503a35
- Main IPC: B29C61/04
- IPC: B29C61/04 ; B29C61/06

Abstract:
An expansion apparatus includes: a first expander for irradiating with electromagnetic waves emitted from a lamp a thermal conversion layer for conversion of the electromagnetic waves to heat, to cause at least a portion of a thermal expansion layer to expand, the thermal conversion layer being laminated to a molding sheet including a base and the thermal expansion layer laminated to a first main surface of the base; and a second expander for causing expansion of a region (C) of the thermal expansion layer that is smaller in size than a region (B) of the thermal expansion layer expanded by the first expander.
Public/Granted literature
- US11633906B2 Expansion apparatus, shaping system, and manufacturing method of shaped object Public/Granted day:2023-04-25
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