Invention Application
- Patent Title: INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
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Application No.: US16790933Application Date: 2020-02-14
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Publication No.: US20200185305A1Publication Date: 2020-06-11
- Inventor: Seungwon IM , Oseob JEON , Byoungok LEE , Yoonsoo LEE , Joonseo SON , Dukyong LEE , Changyoung PARK
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Main IPC: H01L23/433
- IPC: H01L23/433 ; H01L25/065 ; H01L23/498 ; H01L23/13 ; H01L23/495 ; H01L23/473
Abstract:
Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the second die, the spacer include a junction cooling pipe therethrough.
Public/Granted literature
- US11201105B2 Semiconductor package having a spacer with a junction cooling pipe Public/Granted day:2021-12-14
Information query
IPC分类:
