Invention Application
- Patent Title: SELECTABLE VIAS FOR BACK END OF LINE INTERCONNECTS
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Application No.: US16243790Application Date: 2019-01-09
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Publication No.: US20200219804A1Publication Date: 2020-07-09
- Inventor: Christopher Jezewski , Ashish Agrawal , Kevin L. Lin , Abhishek Sharma , Carl Naylor , Urusa Alaan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L23/522 ; H01L27/12 ; H01L29/417 ; H01L29/24 ; H01L29/423 ; H01L23/535 ; H01L29/786 ; H01L21/768 ; H01L29/66 ; H01L21/02 ; H01L21/4763

Abstract:
Integrated circuits including selectable vias are disclosed. The techniques are particularly well-suited to back end of line (BEOL) processes. In accordance with some embodiments, a selectable via includes a vertically-oriented thin film transistor structure having a wrap around gate, which can be used to effectively select (or deselect) the selectable via ad hoc. When a selectable via is selected, a signal is allowed to pass through the selectable via. Conversely, when the selectable via is not selected, a signal is not allowed to pass through the selectable via. The selectable characteristic of the selectable via allows multiple vias to share a global interconnect. The global interconnect can be connected to any number of selectable vias, as well as standard vias.
Public/Granted literature
- US11670588B2 Selectable vias for back end of line interconnects Public/Granted day:2023-06-06
Information query
IPC分类: