- 专利标题： Wafer Processing Tools and Methods Thereof
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申请号： US16738798申请日： 2020-01-09
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公开(公告)号： US20200234995A1公开(公告)日： 2020-07-23
- 发明人: Jagan Rangarajan , Edward Golubovsky , Shaun Van Der Veen , Justin Ho Kuen Wong , Steven M. Zuniga
- 申请人： Jagan Rangarajan , Edward Golubovsky , Shaun Van Der Veen , Justin Ho Kuen Wong , Steven M. Zuniga
- 主分类号： H01L21/687
- IPC分类号： H01L21/687 ; B24B41/06 ; H01L21/677
摘要：
A wafer processing device may include a wafer exchanger including two or more blades, each of the two or more blades may be configured to receive a wafer, the two or more blades may be rotatable about an axis on a single horizontal plane, and the two or more blades may be movable between at least a load cup and a robot access location; wherein the load cup may include a wafer station that is vertically moveable relative a blade located in the load cup and may be configured to remove a wafer from a blade located in the load cup and place a wafer on a blade located in the load cup. Other devices, load cups and methods are also disclosed herein.
公开/授权文献
- US11749552B2 Wafer processing tools and methods thereof 公开/授权日：2023-09-05
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